公开(公告)号：US11762157B2

公开(公告)日：2023-09-19

申请号：US17482485

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Sufi Ahmed ,  Vineeth Abraham ,  Eric Moret ,  Paul Diglio

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/38

CPC classification number: G02B6/4239 ,  G02B6/3636 ,  G02B6/3839

Abstract: The present disclosure relates to a method including arranging multiple optical fibers between a die and a lid, wherein the die is bent and comprises multiple grooves, each optical fiber in or close to a separate groove; bonding the lid to the die to hold the multiple optical fibers in place in the multiple grooves, wherein the bonding comprises applying a bonding force non-uniformly across the lid to conform the lid to the bent die. A corresponding system is also disclosed herein.

公开(公告)号：US11808988B2

公开(公告)日：2023-11-07

申请号：US17482482

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Vineeth Abraham ,  Wesley Morgan ,  Eric Moret ,  Paul Diglio ,  Srikant Nekkanty

IPC: G02B6/30 ,  G02B6/42

CPC classification number: G02B6/30 ,  G02B6/4224

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

公开(公告)号：US20230204878A1

公开(公告)日：2023-06-29

申请号：US17560847

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Wesley B. Morgan ,  Sufi R. Ahmed ,  Vineeth Abraham ,  Sivakumar Yagnamurthy ,  Xiaoqian Li ,  Srikant Nekkanty

IPC: G02B6/42

CPC classification number: G02B6/4212 ,  G02B6/4239 ,  G02B6/4243

Abstract: A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.