公开(公告)号：US20220374354A1

公开(公告)日：2022-11-24

申请号：US17844568

申请日：2022-06-20

Applicant: Intel Corporation

Inventor： Sridhar MUTHRASANALLUR ,  Rajesh M. SANKARAN

IPC: G06F12/02

Abstract: A system on chip (SoC) coupled to a memory can perform a hot-remove operation in a computer system. In a hot-remove operation, software (e.g., operating system) and hardware (e.g., memory controller and interconnect circuitry) components migrate memory content from one region to another target region in the memory. A peripheral device can have direct memory access (DMA) to a page in the region of memory that is being hot-removed. The interconnect circuitry can migrate the page to the target region while maintaining the peripheral device's direct access to the memory. Interconnect circuitry uses hardware mirroring in response to a write command to a memory address in the region being hot-removed. With hardware mirroring, the data is stored in two locations; the first location is the memory address in the region being moved, and the second location is a memory address in the target region.