公开(公告)号：US20190311960A1

公开(公告)日：2019-10-10

申请号：US15948851

申请日：2018-04-09

Applicant: Intel Corporation

Inventor： Terrence Huat Hin Tan ,  Rehan Sheikh ,  Michael T. Klinglesmith ,  Sukhbinder Takhar ,  Shi Hou Chong ,  Kok Hin Oon ,  Wai Loon Yip ,  Yudhishthira Kundu ,  Deepak R. Tanna

IPC: H01L21/66 ,  H01L25/065 ,  H01L23/498 ,  G01R31/28

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

公开(公告)号：US11476168B2

公开(公告)日：2022-10-18

申请号：US15948851

申请日：2018-04-09

Applicant: Intel Corporation

Inventor： Terrence Huat Hin Tan ,  Rehan Sheikh ,  Michael T. Klinglesmith ,  Sukhbinder Takhar ,  Shi Hou Chong ,  Kok Hin Oon ,  Wai Loon Yip ,  Yudhishthira Kundu ,  Deepak R. Tanna

IPC: H01L21/66 ,  H01L25/065 ,  H01L23/498 ,  G01R31/28

Abstract: Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.