公开(公告)号：US11380755B2

公开(公告)日：2022-07-05

申请号：US16650826

申请日：2017-12-18

Applicant: Intel Corporation

Inventor： Domagoj Siprak ,  Jonas Fritzin ,  Sundaravadanan Anantha Krishnan

IPC: H01L49/02 ,  H01L23/66 ,  H01P3/02 ,  H01L23/522

Abstract: Capacitors are disclosed. A capacitor includes a plate-to-plate capacitor and a finger-to-finger capacitor. The plate-to-plate capacitor includes at least a first plate and a second plate. The second plate is in proximity to the first plate. The finger to finger capacitor is in proximity to the first plate. The finger to finger capacitor includes a first plurality of finger elements and a second plurality of finger elements. The second plurality of finger elements is interleaved with the first plurality of finger elements. The first plurality of finger elements is electrically connected to the first plate and the second plurality of finger elements is electrically connected to the second plate. The second plurality of finger elements and the first plate form additional plate-to-plate capacitors.