公开(公告)号：US20210185850A1

公开(公告)日：2021-06-17

申请号：US17185681

申请日：2021-02-25

Applicant: Intel Corporation

Inventor： Devdatta Prakash Kulkarni ,  Nishi Ahuja ,  Sandeep Ahuja ,  Timothy M. Gates ,  Casey Robert Winkel

IPC: H05K7/20

Abstract: Two liquid cooling mechanisms are provided for cooling integrated circuit components immersed in an open bath immersion tank. In the first mechanism, heat generated by high-thermal design power (TDP) components is absorbed by a working fluid passing through cold plates coupled to the high-TDP components. The cold plates are part of direct liquid cooling loops attached to supply and return manifolds fluidly connected to a cooling distribution unit. In the second mechanism, integrated circuit components not coupled to any of the direct liquid cooling loops dissipate heat directly to the immersion fluid. In some embodiments, the tank is a closed bath immersion tank and heat captured by the working fluid is reclaimed and converted to electricity. Working fluid flow rate can be adjusted based on integrated circuit component power consumption levels to achieve a desired working fluid temperature as it enters an energy reclamation unit.