公开(公告)号：US20230422389A1

公开(公告)日：2023-12-28

申请号：US18344308

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tejas J. Shah ,  Yi Xia ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Vishnu Prasadh Sugumar ,  Vikas Kundapura Rao ,  Srinivasa Rao Damaraju ,  Ridvan Amir Sahan ,  Emad Shehadeh Al-Momani ,  Rahima Khatun Mohammed ,  Mirui Wang ,  Devdatta Prakash Kulkarni

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K1/0271 ,  H05K2201/064

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.

公开(公告)号：US12055986B2

公开(公告)日：2024-08-06

申请号：US17187164

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

CPC classification number: G06F1/206 ,  H05K1/0272 ,  G06F2200/201

Abstract: A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

公开(公告)号：US20210208647A1

公开(公告)日：2021-07-08

申请号：US17187164

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

Abstract: A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

公开(公告)号：US20240345639A1

公开(公告)日：2024-10-17

申请号：US18755226

申请日：2024-06-26

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Aardra B. Athalye ,  Devdatta Prakash Kulkarni ,  Gilberto Rayas Paredes ,  Bijoyraj Sahu

IPC: G06F1/20 ,  H05K1/02

CPC classification number: G06F1/206 ,  H05K1/0272 ,  G06F2200/201

Abstract: Flexible and modular top and bottom side processor unit module cooling is disclosed. An example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.

公开(公告)号：US20210190218A1

公开(公告)日：2021-06-24

申请号：US17164670

申请日：2021-02-01

Applicant: Intel Corporation

Inventor： Mark Edmund Sprenger ,  Devdatta Prakash Kulkarni ,  Joseph A. Broderick

IPC: F16K5/16 ,  F16K47/04 ,  F16L37/00

Abstract: A quick disconnect fitting includes a plug and a socket to receive the plug. The plug includes a fluid channel, an inlet to the fluid channel, and a pressure regulating valve assembly. The valve can include a poppet, and a valve nozzle comprising an orifice. The valve assembly resides in the fluid channel. The socket includes a socket stem to contact the valve assembly and push the valve assembly into the fluid channel of the plug upon the socket receiving the plug.

公开(公告)号：US20240260233A1

公开(公告)日：2024-08-01

申请号：US18565880

申请日：2021-11-11

Applicant: Intel Corporation

Inventor： Ming Zhang ,  Yuehong Fan ,  Peng Wei ,  Chuanlou Wang ,  Rajiv K. Mongia ,  Guocheng Zhang ,  Yingqiong Bu ,  Berhanu Wondimu ,  Guixiang Tan ,  Xiang Que ,  Qing Jiang ,  Liu Yu ,  Wei-Ming Chu ,  Chen Zhang ,  Hao Zhou ,  Feng Qi ,  Catharina Biber ,  Devdatta Prakash Kulkarni ,  Xiang Li ,  Yechi Zhang

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473

CPC classification number: H05K7/20336 ,  G06F1/20 ,  H01L23/4093 ,  H01L23/427 ,  H01L23/473 ,  G06F2200/201

Abstract: Heat pipes and vapor chambers that are components of a DIMM cooling assembly are described.

公开(公告)号：US20210185850A1

公开(公告)日：2021-06-17

申请号：US17185681

申请日：2021-02-25

Applicant: Intel Corporation

Inventor： Devdatta Prakash Kulkarni ,  Nishi Ahuja ,  Sandeep Ahuja ,  Timothy M. Gates ,  Casey Robert Winkel

IPC: H05K7/20

Abstract: Two liquid cooling mechanisms are provided for cooling integrated circuit components immersed in an open bath immersion tank. In the first mechanism, heat generated by high-thermal design power (TDP) components is absorbed by a working fluid passing through cold plates coupled to the high-TDP components. The cold plates are part of direct liquid cooling loops attached to supply and return manifolds fluidly connected to a cooling distribution unit. In the second mechanism, integrated circuit components not coupled to any of the direct liquid cooling loops dissipate heat directly to the immersion fluid. In some embodiments, the tank is a closed bath immersion tank and heat captured by the working fluid is reclaimed and converted to electricity. Working fluid flow rate can be adjusted based on integrated circuit component power consumption levels to achieve a desired working fluid temperature as it enters an energy reclamation unit.