公开(公告)号：US20250004044A1

公开(公告)日：2025-01-02

申请号：US18344869

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Vijay HOSAMANI ,  Vikas Mishra ,  Kavitha Nagarajan ,  Zaman Zaid Mulla

IPC: G01R31/28 ,  H05K1/02

Abstract: The present disclosure generally relates to an electronic system including a semiconductor package and a circuit board. The semiconductor package and the circuit board may include contact structures configurable to have an output terminal of one contact structure connected to an input terminal of another contact structure so as to render a continuous electrical pathway through the contact structures, wherein the contact structures may be configured in a daisy chain manner forming a series connection, and wherein the continuous electrical pathway may render an output pattern in response to an electrical stimulus introduced to the electronic system.