公开(公告)号：US20250079300A1

公开(公告)日：2025-03-06

申请号：US18240318

申请日：2023-08-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Neelam PRABHU GAUNKAR ,  Henning BRAUNISCH ,  Wenhao LI ,  Feras EID ,  Georgios C. DOGIAMIS

IPC: H01L23/522 ,  H01F1/03 ,  H01F41/16

Abstract: Magnetic inductors for microelectronics packages are provided. Magnetic inductive structures include a magnetic region, a magnetic region base region, and a conductive region that forms a channel within the magnetic region. The magnetic region has a different chemical composition than the base region. Additional structures are provided in which the magnetic region is recessed into a package substrate core. Further inductor structures are provided in which the conductive region includes through-core vias and the conductive region at least partially encircles a portion of a package substrate core. Additionally, methods of manufacture are provided for semiconductor packages that include magnetic inductors.