公开(公告)号：US10555417B2

公开(公告)日：2020-02-04

申请号：US16281045

申请日：2019-02-20

申请人： Intel Corporation

发明人： Damion Searls ,  Weston C. Roth ,  Margaret D. Ramirez ,  James D. Jackson ,  Rainer E. Thomas ,  Charles A. Gealer

IPC分类号： H01L21/56 ,  H01L23/48 ,  H05K7/00 ,  H05K1/18 ,  H01L23/498 ,  H01L25/03 ,  H01L23/552 ,  H01L23/00 ,  H05K3/28

摘要： Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.