公开(公告)号：US20230396025A1

公开(公告)日：2023-12-07

申请号：US18454487

申请日：2023-08-23

Applicant: Intel Corporation

Inventor： Ying Ern Ho ,  Boon Ping Koh ,  Ya Yeing Lo ,  Luqman Al-Hakim Mohd Nasran ,  Ameera Wahida Solikhudin

IPC: H01R13/6596 ,  H01B7/17 ,  H01R13/26

CPC classification number: H01R13/6596 ,  H01B7/17 ,  H01R13/26

Abstract: A magnetic grounding technique implements a magnet assembly. The magnet assembly may be soldered to a component to facilitate grounding of a metal shield layer of a cable assembly. A cable plating may be plated onto an exposed part of the insulator of a cable assembly to form the cable assembly, and which galvanically contacts the metal shield layer of the cable assembly. The cable plating may comprise an electrically conductive and magnetic material to ensure magnetic attraction with the magnet assembly. The magnetic assembly is thus magnetically attracted to the cable plating, and also provides galvanic contact between the cable plating and, in turn, the metal shield layer of the cable and ground to reduce RFI. The magnet assembly also magnetically aligns the cable connection pins with those of a mating connector, thus reducing the strain placed on the connectors.