SYSTEMS AND METHODS FOR UCIe-AIB CHIPLET INTERFACE INTEROPERABILITY

    公开(公告)号:US20230096585A1

    公开(公告)日:2023-03-30

    申请号:US18075183

    申请日:2022-12-05

    Abstract: The present disclosure is directed to improving compatibility between chiplets integrated with disparate chiplet interfaces. To reduce compatibility issues due non-matching bump maps, a dual-mode bump map assignment may be implemented to enable a chiplet to utilize multiple signal number sequence assignments. Additionally, a modularized Advanced Interface Bus (AIB) interface may be implemented to reduce channel mismatch in AIB -UCIe multi-channel interoperability.

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