公开(公告)号：US20180286780A1

公开(公告)日：2018-10-04

申请号：US15473251

申请日：2017-03-29

Applicant: Intel IP Corporation

Inventor： Quan Qi ,  Brian R. Butcher ,  Carlton E. Hanna ,  Hong Wei Hu

IPC: H01L23/433 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.

公开(公告)号：US10103088B1

公开(公告)日：2018-10-16

申请号：US15473251

申请日：2017-03-29

Applicant: Intel IP Corporation

Inventor： Quan Qi ,  Brian R. Butcher ,  Carlton E. Hanna ,  Hong Wei Hu

IPC: H01L23/498 ,  H01L23/433 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include a die disposed on a first substrate, at least one component adjacent the die on the first substrate, a molding material on the die and the at least one component, wherein the die and the at least one component are completely embedded in the molding material, a second substrate, wherein the first substrate is disposed on a top surface of the second substrate, and at least one communication structure disposed on a surface of the second substrate.