Abstract:
Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
Abstract:
Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
Abstract:
Certain implementations of the disclosed technology may include systems, methods, and apparatus for common mode signal cancellation in force change detectors. An example embodiment of the disclosed technology includes a press sensor element configured to reduce or eliminate thermally induced signals. The sensor element includes a piezoelectric layer that includes a first surface in communication with a first layer. The first layer includes a first conductive region. The piezoelectric layer includes a second surface in communication with a second layer. The second layer includes a second conductive region, a third conductive region, and a non-conductive void region separating the second conductive region and the third conductive region. The second and third conductive regions are configured to substantially reduce a thermally-induced voltage change between two or more of the first, second and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
Abstract:
Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
Abstract:
Certain example embodiments include a press sensor element that includes a piezoelectric layer having a first surface in communication with a first layer, the first layer including a first conductive region, where the first conductive region covers at least a central portion the first surface. The sensor element includes a second surface in communication with a second layer, the second layer including a second conductive region, a third conductive region, and a first non-conductive void region separating the second conductive region and the third conductive region. An area of the first conductive region is configured in size relative to an area of the third conductive region to substantially reduce a thermally-induced voltage change between two or more of the first, second, and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.
Abstract:
Certain implementations of the disclosed technology may include systems, methods, and apparatus for common mode signal cancellation in force change detectors. An example embodiment of the disclosed technology includes a press sensor element configured to reduce or eliminate thermally induced signals. The sensor element includes a piezoelectric layer that includes a first surface in communication with a first layer. The first layer includes a first conductive region. The piezoelectric layer includes a second surface in communication with a second layer. The second layer includes a second conductive region, a third conductive region, and a non-conductive void region separating the second conductive region and the third conductive region. The second and third conductive regions are configured to substantially reduce a thermally-induced voltage change between two or more of the first, second and third conductive regions responsive to a corresponding temperature change of at least a portion of the piezoelectric layer.