公开(公告)号：US20140188264A1

公开(公告)日：2014-07-03

申请号：US13727896

申请日：2012-12-27

Applicant: Intermolecular, Inc.

Inventor： Harikrishanan Rajagopal ,  Yoshiki E. Ashizawa ,  Joseph M. Jackson ,  Sandeep Mariserla ,  Heng Cheng Pai ,  Radha Subrahmanyan ,  Karen Yang

IPC: H01L21/66

CPC classification number: H01L23/544 ,  G05B19/41865 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y02P80/40 ,  Y02P90/20 ,  H01L2924/00

Abstract: Methods of semiconductor processing are described. An experiment is designed for each process of a semiconductor substrate, which are implemented on respective multiple regions of the semiconductor substrate. A unique identifier is assigned to the semiconductor substrate. The respective design of experiment is implemented for each of the processes of the semiconductor substrate. Process criteria for each process is recorded, where the recording is associated with the assigned unique identifier. Process information is retrieved for each process, via its respective assigned unique identifier.

Abstract translation: 描述半导体处理方法。 针对在半导体衬底的相应多个区域上实现的半导体衬底的每个工艺设计实验。 将独特的标识符分配给半导体衬底。 对于半导体衬底的每个工艺实现相应的实验设计。 记录每个处理的处理标准，其中记录与分配的唯一标识符相关联。 通过其各自分配的唯一标识符为每个进程检索处理信息。