公开(公告)号：US11342697B2

公开(公告)日：2022-05-24

申请号：US16892426

申请日：2020-06-04

申请人： International Business Machines Corporation

发明人： Paul W Coteus ,  Thomas Cipolla ,  Kyu-hyoun Kim ,  Edmund Blackshear

IPC分类号： H01R12/72 ,  H05K3/00 ,  H05K1/18 ,  H01R12/70

摘要： A card, e.g. a printed circuit board (PCB), has one or more conductive layers and one or more non-conductive layers disposed and alternating upon one another to form a stack. One or more of the conductive layers has one or more wiring elements within the conductive layer. The PCB/card has one or more card edges. The PCB also has a plurality of dual-level pad structures on each of one or more of the card edges. The dual-level pad structures each have an upper level, a lower level, and two or more walls. The lower level is a conductive pad with conductive surface. At least one of the conductive pads electrically connects to one or more of the wiring elements and/or one or more vias. In each of the dual-level pad structures, the walls and upper level may be made of an electrically non-conductive, insulating, or dielectric material or may be covered with a conductive material that electrically connects to conductive surface. There are different non-limiting embodiments of the structures and methods of making the structures.

公开(公告)号：US20210384661A1

公开(公告)日：2021-12-09

申请号：US16892426

申请日：2020-06-04

申请人： International Business Machines Corporation

发明人： Paul W. Coteus ,  Thomas Cipolla ,  Kyu-hyoun Kim ,  Edmund Blackshear

IPC分类号： H01R12/72 ,  H05K3/00 ,  H01R12/70 ,  H05K1/18

摘要： A card, e.g. a printed circuit board (PCB), has one or more conductive layers and one or more non-conductive layers disposed and alternating upon one another to form a stack. One or more of the conductive layers has one or more wiring elements within the conductive layer. The PCB/card has one or more card edges. The PCB also has a plurality of dual-level pad structures on each of one or more of the card edges. The dual-level pad structures each have an upper level, a lower level, and two or more walls. The lower level is a conductive pad with conductive surface. At least one of the conductive pads electrically connects to one or more of the wiring elements and/or one or more vias. In each of the dual-level pad structures, the walls and upper level may be made of an electrically non-conductive, insulating, or dielectric material or may be covered with a conductive material that electrically connects to conductive surface. There are different non-limiting embodiments of the structures and methods of making the structures.