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公开(公告)号:US06541334B2
公开(公告)日:2003-04-01
申请号:US09891188
申请日:2001-06-25
申请人: Jörn Luetzen , Bernhard Sell
发明人: Jörn Luetzen , Bernhard Sell
IPC分类号: H01L218242
CPC分类号: H01L27/10861 , H01L27/1087
摘要: The integrated circuit configuration has at least one buried circuit element and an insulating layer. A multiplicity of insulating regions are in contact with one another to forming a locally delimited insulating layer in the substrate. In this way, trench capacitors implemented as buried circuit elements can be manufactured with a structure size of less than 100 nm in a simple and cost-effective manner.