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公开(公告)号：US06576111B1
公开(公告)日：2003-06-10
申请号：US09674509
申请日：2000-12-28
IPC分类号： C25D338
摘要： A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.
摘要翻译： 一种用于在酸性铜浴中使用不溶性阳极镀铜的方法，其中单独补充消耗的铜离子，其特征在于铜离子的主要部分直接以碳酸铜和/或碱式碳酸铜的形式供应，分配 具有隔膜和辅助电解质，在相对于工作电解质以旁路模式操作的单独的罐中，释放的气态CO 2在所述单独的罐中被分离。
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公开(公告)号：US20060272951A1
公开(公告)日：2006-12-07
申请号：US11380559
申请日：2006-04-27
申请人： Ulrich Schmergel , Jean Rasmussen
发明人： Ulrich Schmergel , Jean Rasmussen
IPC分类号： C25D3/38
摘要： A plating process employing an anode having a precious metal-based active material, and an electrolytic plating composition comprising a source of metal ions in an amount sufficient to electrolytically deposit a metal such as Cu onto the substrate, a source of chloride ions in an amount sufficient to provide at least 70 mg/L chloride ions into the composition, and a source of a d-block metal ions selected from the group consisting of molybdenum, vanadium, zirconium, tantalum, tungsten, hafnium, and titanium.
摘要翻译： 使用具有贵金属基活性物质的阳极的电镀工艺，以及包含足以将金属如Cu电解沉积到基板上的量的金属离子源的电解电镀组合物，量的氯离子源 足以在组合物中提供至少70mg / L的氯离子，以及选自钼，钒，锆，钽，钨，铪和钛的d-块金属离子源。
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