公开(公告)号：US20110180923A1

公开(公告)日：2011-07-28

申请号：US12693646

申请日：2010-01-26

申请人： JAMES N. HUMENIK ,  SUSHUMNA IRUVANTI ,  RICHARD LANGLOIS ,  HSICHANG LIU ,  GOVINDARAJAN NATARAJAN ,  KAMAL K. SIKKA ,  HILTON T. TOY ,  JIANTAO ZHENG ,  GREGG B. MONJEAU ,  MARK KAPFHAMMER

发明人： JAMES N. HUMENIK ,  SUSHUMNA IRUVANTI ,  RICHARD LANGLOIS ,  HSICHANG LIU ,  GOVINDARAJAN NATARAJAN ,  KAMAL K. SIKKA ,  HILTON T. TOY ,  JIANTAO ZHENG ,  GREGG B. MONJEAU ,  MARK KAPFHAMMER

IPC分类号： H01L23/02 ,  H01L21/58

CPC分类号： H01L23/42 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

摘要翻译： 芯片的前端结合到芯片载体的顶表面。 密封材料被分配在芯片载体的顶表面的周边。 提供具有第一侧和第二侧的焊料TIM。 TIM的第一面接触芯片的背面。 进行回流以融化TIM。 TIM的第二面粘合到盖子上。 密封材料固化。 盖子附接到芯片载体的顶表面。 回填材料被注入到芯片载体的顶表面和盖子之间的空间中。 回填材料邻接TIM的两侧。 回填材料固化。 TIM焊料裂纹和相关的热降解得到缓解。