公开(公告)号：US20230014841A1

公开(公告)日：2023-01-19

申请号：US17949385

申请日：2022-09-21

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Masaharu KOBAYASHI ,  Toshiro HIRAMOTO ,  Jixuan WU

IPC: H01L27/24 ,  H01L45/00 ,  H01L29/786

Abstract: A three-dimensional array device with multiple layers in height direction includes a first two-dimensional array circuit located in a first layer; and a second two-dimensional array circuit located in a second layer adjacent to the first layer and overlapped in a plan view with the first two-dimensional array circuit. Each of the first two-dimensional array circuit and the second two-dimensional array circuit has a first wiring group, an input part that inputs signals to the first wiring group, a second wiring group that intersects the first wiring group and an output part that outputs signals from the second wiring group. The output part in the first two-dimensional array circuit is overlapped in a plan view on the input part in the second two-dimensional array circuit and is connected in a signal transferable manner.