公开(公告)号：US11758829B2

公开(公告)日：2023-09-12

申请号：US17283037

申请日：2019-10-31

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Yasunobu Nakamura ,  Yutaka Tabuchi ,  Shuhei Tamate

IPC: H10N69/00 ,  G06N10/00 ,  H10N60/12 ,  H10N60/80

CPC classification number: H10N69/00 ,  G06N10/00 ,  H10N60/12 ,  H10N60/805

Abstract: A superconducting complex quantum computing circuit includes a circuit substrate in which a wiring pattern of a circuit element including quantum bits and measurement electrodes, and ground patterns are formed, and through-electrodes connecting the ground pattern formed on a first surface of the substrate surface and the ground pattern formed on a second surface; a first ground electrode including a first contact portion in contact with the ground patterns, and a first non-contact portion having a shape corresponding to a shape of the wiring pattern; a second ground electrode including a second contact portion in contact with the ground pattern; a control signal line provided with a contact spring pin at a tip; and a pressing member that presses the first ground electrode against the first surface of the circuit substrate or presses the second ground electrode against the second surface of the circuit substrate.

公开(公告)号：US12178143B2

公开(公告)日：2024-12-24

申请号：US18224685

申请日：2023-07-21

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Yasunobu Nakamura ,  Yutaka Tabuchi ,  Shuhei Tamate

IPC: H10N69/00 ,  G06N10/00 ,  H10N60/12 ,  H10N60/80

Abstract: A superconducting complex quantum computing circuit includes a circuit substrate in which a wiring pattern of a circuit element including quantum bits and measurement electrodes, and ground patterns are formed, and through-electrodes connecting the ground pattern formed on a first surface of the substrate surface and the ground pattern formed on a second surface; a first ground electrode including a first contact portion in contact with the ground patterns, and a first non-contact portion having a shape corresponding to a shape of the wiring pattern; a second ground electrode including a second contact portion in contact with the ground pattern; a control signal line provided with a contact spring pin at a tip; and a pressing member that presses the first ground electrode against the first surface of the circuit substrate or presses the second ground electrode against the second surface of the circuit substrate.