SILICONE RESIN COMPOSITION
    1.
    发明公开

    公开(公告)号:US20240199814A1

    公开(公告)日:2024-06-20

    申请号:US18285263

    申请日:2022-03-22

    CPC classification number: C08G77/18 C08K3/22 C08L83/06 C08K2003/2227

    Abstract: Provided is a silicone resin composition which exhibits excellent workability and which maintains fluidity even if filled, to a high degree, with a thermally conductive filler. This silicone resin composition contains: a component (A), an organopolysiloxane which is represented by a formula (1) and has a molecular weight distribution (Mw/Mn) of 1.20 or less; and a component (B), a thermally conductive filler. In the formula (1), R1 are each independently a monovalent saturated hydrocarbon group or a monovalent aromatic hydrocarbon group, R2 is a monovalent saturated hydrocarbon group, X is oxygen or a divalent hydrocarbon group, n is an integer of 1 or more, and a is an integer between 1 and 3.

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