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    Expanded thermoplastic polyurethane particles and expanded thermoplastic polyurethane particle molded article
    3.
    发明授权
    Expanded thermoplastic polyurethane particles and expanded thermoplastic polyurethane particle molded article 有权

    公开(公告)号：US11208537B2

    公开(公告)日：2021-12-28

    申请号：US16463755

    申请日：2017-11-15

    Applicant: JSP Corporation

    Inventor： Tatsuya Hayashi ,  Nobumasa Koshita ,  Masaharu Oikawa

    IPC: C08J9/232 ,  C08J9/20

    Abstract: The present invention provides expanded beads of thermoplastic polyurethane, wherein the thermoplastic polyurethane constituting the expanded beads is an ether-based thermoplastic polyurethane, and a difference (T1−T2) between a melting peak temperature (T1) and a melting peak temperature (T2) is from 0 to 8° C., wherein the melting peak temperature (T1) is a melting peak temperature at the time of first heating in a DSC curve obtained by heating the expanded beads from 20° C. to 260° C. at a heating rate of 10° C./min, the melting peak temperature (T2) is a melting peak temperature at the time of second heating in a DSC curve obtained by cooling from 260° C. to 20° C. at a cooling rate of 10° C./min after the first heating and further heating again from 20° C. to 260° C. at a heating rate of 10° C./min, and the DSC curves are obtained by the heat flux differential scanning calorimetry in conformity with JIS K7121-1987. The expanded beads of thermoplastic polyurethane not only have excellent surface appearance and fusion bonding properties but also have a low shrinkage factor.

    Polyamide resin foamed particles and method for producing same
    4.
    发明授权
    Polyamide resin foamed particles and method for producing same 有权

    公开(公告)号：US12129350B2

    公开(公告)日：2024-10-29

    申请号：US17273232

    申请日：2019-09-04

    Applicant: JSP Corporation

    Inventor： Tatsuya Hayashi ,  Akinobu Hira

    IPC: C08J9/18 ,  C08J9/16

    CPC classification number: C08J9/18 ,  C08J2377/06

    Abstract: A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.

    Polyamide-based resin expanded beads and molded article of polyamide-based resin expanded beads
    5.
    发明授权
    Polyamide-based resin expanded beads and molded article of polyamide-based resin expanded beads 有权

    公开(公告)号：US11993690B2

    公开(公告)日：2024-05-28

    申请号：US17168762

    申请日：2021-02-05

    Applicant: JSP CORPORATION

    Inventor： Tatsuya Hayashi

    IPC: C08J9/18 ,  C08J9/228

    CPC classification number: C08J9/18 ,  C08J9/228 ,  C08J2201/03 ,  C08J2203/14 ,  C08J2377/00

    Abstract: The polyamide-based resin expanded beads are expanded beads including a polyamide-based resin as a base resin, in which the average value of bead weight of the expanded beads is 0.5 mg or more and 8 mg or less, the coefficient of variation of the bead weight of the expanded beads is 10% or less, and the average value of the ratio of a long diameter to a short diameter (a long diameter/a short diameter) of the expanded beads measured with a projection image photographing type bead size distribution analyzer is 1 or more and 1.5 or less, the coefficient of variation of the ratio (a long diameter/a short diameter) is 12% or less, the average value of the a short diameter is 1 mm or more and 4 mm or less, and the coefficient of variation of the a short diameter is 10% or less.

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