公开(公告)号：US20230074915A1

公开(公告)日：2023-03-09

申请号：US17790997

申请日：2021-01-21

Applicant: JSP CORPORATION

Inventor： Tomohito SHIMADA ,  Hajime OHTA

IPC: C08J9/16 ,  C08J9/228 ,  C08J9/224 ,  B32B5/18 ,  B32B1/00 ,  B32B27/06 ,  B32B27/32

Abstract: An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.