公开(公告)号：US11732101B2

公开(公告)日：2023-08-22

申请号：US17790997

申请日：2021-01-21

申请人： JSP CORPORATION

发明人： Tomohito Shimada ,  Hajime Ohta

IPC分类号： B32B27/16 ,  C08J9/224 ,  C08J9/16 ,  B32B1/00 ,  B32B5/18 ,  B32B27/06 ,  B32B27/32 ,  C08J9/228

CPC分类号： C08J9/16 ,  B32B1/00 ,  B32B5/18 ,  B32B27/065 ,  B32B27/32 ,  C08J9/224 ,  C08J9/228 ,  B32B2266/025 ,  B32B2307/72 ,  C08J2323/12 ,  C08J2423/12

摘要： An expanded bead having a through hole and including a foamed core layer which defines the through hole therein and which is constituted of a resin composition containing two kinds of polypropylene-based resins having different melting points, and a cover layer covering the foamed core layer and constituted of a polyolefin-based resin. The expanded bead gives a DSC curve in which an endothermic peak intrinsic to the resin composition and another endothermic peak on a higher temperature side thereof appear in a specific heat of fusion ratio. Molded articles include a multiplicity of the expanded beads.