公开(公告)号：US11195714B2

公开(公告)日：2021-12-07

申请号：US16922010

申请日：2020-07-07

Applicant: JSR CORPORATION

Inventor： Hitoshi Osaki ,  Jeffrey Kmiec

IPC: H01L21/02 ,  H01L21/306

Abstract: A pattern-forming method includes forming a patterned coating film on a part of a surface layer of a base. The surface layer includes regions each of which includes a material that differs from each other. A part of the regions is the part of the surface layer on which the patterned coating film is formed. The patterned coating film includes a first polymer including at an end of a main chain or a side chain thereof a group including a first functional group that is capable of bonding to an atom present in the part of the region. An atom layer is directly or indirectly formed on the surface layer of the base by a vapor deposition, after the forming of the patterned coating film.