公开(公告)号：US12011777B2

公开(公告)日：2024-06-18

申请号：US16768681

申请日：2018-10-30

申请人： JSW AKTINA SYSTEM CO., LTD.

发明人： Yoshihiro Yamaguchi ,  Miki Sawai ,  Sadao Tanigawa ,  Hirotaka Sazuka ,  Naoyuki Kobayashi

IPC分类号： B23K26/03 ,  B23K26/50 ,  B23K101/40 ,  H01L21/268

CPC分类号： B23K26/032 ,  B23K26/50 ,  H01L21/268 ,  B23K2101/40

摘要： A laser processing apparatus (1) according to an embodiment includes a processing chamber (18) configured to perform laser processing for an object to be processed (40), a stage (10) disposed inside the processing chamber (18), the stage being configured to convey the object to be processed (40), and a control unit (50) configured to instruct a loading/unloading apparatus (30) about a placement position of the object to be processed (40) over the stage (10), the loading/unloading apparatus (30) being configured to load/unload the object to be processed (40) into/from the processing chamber (18). Further, the processing chamber (18) includes a loading gate (17a) for loading and an unloading gate (17b) for unloading for the object to be processed (40), and the object to be processed (40) is conveyed only in a first direction from the loading gate (17a) toward the unloading gate (17b) over the stage (10).