公开(公告)号：US11613141B2

公开(公告)日：2023-03-28

申请号：US16746300

申请日：2020-01-17

Applicant: Jacek Tuszynski

Inventor： Jacek Tuszynski

IPC: B42F13/04 ,  B65D63/10

Abstract: A binding device for hole-punched paper and other items can be made from a sheet of material without necessarily requiring metal or plastic parts. The device can include a tie and an arrangement of openings cut in a sheet of material to secure the tie in place and withstand the load of bonded hole-punched paper or other items. Some devices can exhibit flexible thickness, adjusting automatically to the thickness of items being bonded.

公开(公告)号：USD736854S1

公开(公告)日：2015-08-18

申请号：US29495513

申请日：2014-07-01

Applicant: Jacek Tuszynski

Designer： Jacek Tuszynski

公开(公告)号：US20210221161A1

公开(公告)日：2021-07-22

申请号：US16746300

申请日：2020-01-17

Applicant: Jacek Tuszynski

Inventor： Jacek Tuszynski

IPC: B42F13/04 ,  B65D63/10

Abstract: A binding device for hole-punched paper and other items can be made from a sheet of material without necessarily requiring metal or plastic parts. The device can include a tie and an arrangement of openings cut in a sheet of material to secure the tie in place and withstand the load of bonded hole-punched paper or other items. Some devices can exhibit flexible thickness, adjusting automatically to the thickness of items being bonded.