公开(公告)号：US20100071847A1

公开(公告)日：2010-03-25

申请号：US12461933

申请日：2009-08-28

申请人： Jae Bong Shin ,  Byung Joon Lee ,  Seung Dae Seok ,  Seung Woo Choi ,  Jung Hyeon Kim ,  Sang il Hong

发明人： Jae Bong Shin ,  Byung Joon Lee ,  Seung Dae Seok ,  Seung Woo Choi ,  Jung Hyeon Kim ,  Sang il Hong

IPC分类号： B29C65/00

CPC分类号： H01L21/67092 ,  H01L21/2007

摘要： It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.

摘要翻译： 本发明的一个方面是提供一种具有按压装置的晶片接合装置，所述加压装置构造成将固定在定影装置中的晶片按压，其中所述定影装置构造成允许所述按压装置不干扰地挤压所述晶片。 晶片接合装置可以包括上晶片和下晶片，构造成支撑上晶片和下晶片的支撑构件，在上晶片上的推动构件，以及定影装置，其构造成将推动构件固定到支撑构件 ，其中所述推动构件包括从所述上晶片的周边向外延伸的固定部，并且所述定影装置联接到所述固定部。 本发明的另一方面是提供一种接合晶片的方法。