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公开(公告)号:US20100071847A1
公开(公告)日:2010-03-25
申请号:US12461933
申请日:2009-08-28
申请人: Jae Bong Shin , Byung Joon Lee , Seung Dae Seok , Seung Woo Choi , Jung Hyeon Kim , Sang il Hong
发明人: Jae Bong Shin , Byung Joon Lee , Seung Dae Seok , Seung Woo Choi , Jung Hyeon Kim , Sang il Hong
IPC分类号: B29C65/00
CPC分类号: H01L21/67092 , H01L21/2007
摘要: It is an aspect of the present invention to provide a wafer bonding apparatus having a pressing apparatus configured to press wafers fixed in a fixing apparatus, wherein the fixing apparatus is configured to allow the pressing apparatus to press the wafers without interference. The wafer bonding apparatus may include an upper wafer and a lower wafer, a support member configured to support the upper wafer and the lower wafer, a push member on the upper wafer, and a fixing apparatus configured to fix the push member to the support member, wherein the push member includes a fixing part extending outward from a periphery of the upper wafer, and the fixing apparatus is coupled to the fixing part. It is also an aspect of the present invention to provide a method for bonding wafers.
摘要翻译: 本发明的一个方面是提供一种具有按压装置的晶片接合装置,所述加压装置构造成将固定在定影装置中的晶片按压,其中所述定影装置构造成允许所述按压装置不干扰地挤压所述晶片。 晶片接合装置可以包括上晶片和下晶片,构造成支撑上晶片和下晶片的支撑构件,在上晶片上的推动构件,以及定影装置,其构造成将推动构件固定到支撑构件 ,其中所述推动构件包括从所述上晶片的周边向外延伸的固定部,并且所述定影装置联接到所述固定部。 本发明的另一方面是提供一种接合晶片的方法。
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公开(公告)号:US20060048381A1
公开(公告)日:2006-03-09
申请号:US11155181
申请日:2005-06-16
申请人: Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
发明人: Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
IPC分类号: H05K3/30
CPC分类号: H01L21/67144 , H01L21/67092 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53239
摘要: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
摘要翻译: 提供了一种模具附接装置,清洁系统和方法,其具有能够在短时间内容易地替换适用于各种包装的新的部件。 防止模压构件和加热板的表面被污染。 模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。 其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。 加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。
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公开(公告)号:US09431365B2
公开(公告)日:2016-08-30
申请号:US14700251
申请日:2015-04-30
申请人: Seung-dae Seok , Sang-yoon Kim , Hui-jae Kim , Jae-bong Shin
发明人: Seung-dae Seok , Sang-yoon Kim , Hui-jae Kim , Jae-bong Shin
CPC分类号: H01L24/75 , B23K1/00 , B23K3/04 , B23K3/085 , B23K37/047 , B23K2101/40 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2224/16227 , H01L2224/75252 , H01L2224/75501 , H01L2224/7565 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/75841 , H01L2224/75901 , H01L2224/81121 , H01L2224/8118 , H01L2224/81203 , H01L2224/81801 , H01L2224/81908 , H01L2924/00012 , H01L2924/00014
摘要: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
摘要翻译: 一种半导体芯片接合装置,包括:吸附拾取半导体芯片的接合头,支撑基板的接合台,要在接合台上与基板接合的半导体芯片;第一相机,捕获半导体芯片的图像;以及 获得关于半导体芯片的位置信息,第二相机捕获基板的图像并获得关于基板的位置信息,在接合台的第一侧表面处的校正装置结构,校正装置结构包括校正基板 以及至少一个校正芯片,以及接合控制器,其通过所述接合头来控制所述至少一个校正芯片的拾取,所述至少一个校正芯片安装在所述校正衬底上,以及校正接合位置。
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公开(公告)号:US20160079199A1
公开(公告)日:2016-03-17
申请号:US14700251
申请日:2015-04-30
申请人: Seung-dae SEOK , Sang-yoon KIM , Hui-jae KIM , Jae-bong SHIN
发明人: Seung-dae SEOK , Sang-yoon KIM , Hui-jae KIM , Jae-bong SHIN
CPC分类号: H01L24/75 , B23K1/00 , B23K3/04 , B23K3/085 , B23K37/047 , B23K2101/40 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2224/16227 , H01L2224/75252 , H01L2224/75501 , H01L2224/7565 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75804 , H01L2224/75824 , H01L2224/75841 , H01L2224/75901 , H01L2224/81121 , H01L2224/8118 , H01L2224/81203 , H01L2224/81801 , H01L2224/81908 , H01L2924/00012 , H01L2924/00014
摘要: A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
摘要翻译: 一种半导体芯片接合装置,包括:吸附拾取半导体芯片的接合头,支撑基板的接合台,要在接合台上与基板接合的半导体芯片;第一相机,捕获半导体芯片的图像;以及 获得关于半导体芯片的位置信息,第二相机捕获基板的图像并获得关于基板的位置信息,在接合台的第一侧表面处的校正装置结构,校正装置结构包括校正基板 以及至少一个校正芯片,以及接合控制器,其通过所述接合头来控制所述至少一个校正芯片的拾取,所述至少一个校正芯片安装在所述校正衬底上,以及校正接合位置。
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公开(公告)号:US07650687B2
公开(公告)日:2010-01-26
申请号:US11155181
申请日:2005-06-16
申请人: Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
发明人: Jung-Hwan Woo , Ho-Jae Byon , Jae-Bong Shin , Yong-Kyun Sun , Hyun-Ho Kim , Choo-Ho Kim , Youn-Sung Ko
CPC分类号: H01L21/67144 , H01L21/67092 , Y10T29/4913 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53239
摘要: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
摘要翻译: 提供了一种模具附接装置,清洁系统和方法,其具有能够在短时间内容易地替换适用于各种包装的新的部件。 防止模压构件和加热板的表面被污染。 模压构件可拆卸地附接到可以直接对模具施加压力的附接单元的下端。 其上安装有用于研磨加热板的研磨装置的加热板研磨机与模压构件隔开预定距离。 加热板清洁剂附着在加热板研磨机的侧壁上并去除残留在加热板上的残留物。
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公开(公告)号:US20120118876A1
公开(公告)日:2012-05-17
申请号:US13289525
申请日:2011-11-04
申请人: Jung Hyun Cho , Yury Tolmachev , Sang Jean Jeon , Byung Joon Lee , Jae Bong Shin , Hyungjoon Kim , Moon Seok Kim
发明人: Jung Hyun Cho , Yury Tolmachev , Sang Jean Jeon , Byung Joon Lee , Jae Bong Shin , Hyungjoon Kim , Moon Seok Kim
IPC分类号: H05B6/10
摘要: According to example embodiments, a flip chip bonding apparatus includes a metal chamber, a stage in the metal chamber, and a planar antenna in the chamber. The stage may be configured to receive a circuit board having flip chips arranged thereon. The antenna may be configured to bond the flip chips to the circuit board by inductively heating the flip chips on the circuit board.
摘要翻译: 根据示例性实施例,倒装芯片接合装置包括金属室,金属室中的台和室中的平面天线。 该台可以被配置为接收其上布置有倒装芯片的电路板。 天线可以被配置为通过感应加热电路板上的倒装芯片将倒装芯片连接到电路板。
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公开(公告)号:US07294204B2
公开(公告)日:2007-11-13
申请号:US10962864
申请日:2004-10-08
申请人: Daehie Hong , Jung Yup Kim , Hyun Ho Shin , Jae Bong Shin , Woo Chang Lee , In Ju Hwang , Tae Hyung-Kim
发明人: Daehie Hong , Jung Yup Kim , Hyun Ho Shin , Jae Bong Shin , Woo Chang Lee , In Ju Hwang , Tae Hyung-Kim
CPC分类号: E01C23/22
摘要: An apparatus for painting traffic marks on a road surface without requiring any professional painting skills. The apparatus having: a first support and second support being parallel to each other and a coupling unit to couple the supports. There is also a gantry unit, having: at least one Y-axial gantry coupled to and being movable along the first and second support, and an X-axial gantry coupled to the Y-axial gantry to be movable in a direction perpendicular to the first support and second support. The apparatus further includes: a jet unit coupled to the X-axial gantry, with a jet nozzle to spray paint downwards; a feeding device, having a first feeding unit to move the Y-axial gantry and a second feeding unit to move the X-axial gantry. There may be a third feeding unit to move the jet unit. There is also a control unit to control operation of the apparatus.
摘要翻译: 一种用于在路面上绘画交通标志的装置,而不需要任何专业的绘画技巧。 该装置具有:彼此平行的第一支撑件和第二支撑件以及联接支撑件的联接单元。 还有一个龙门架单元,具有:至少一个Y轴架架,其联接到第一和第二支撑件并且可沿其移动;以及X轴架架,其联接到Y轴机架,以便能够沿垂直于 第一支持和第二支持。 所述装置还包括:喷射单元,其联接到所述X轴机架,具有用于向下喷射涂料的喷嘴; 进给装置,具有用于移动Y轴机架的第一进给单元和用于移动X轴机架的第二进给单元。 可以有第三进料单元来移动喷射单元。 还有一个控制单元来控制设备的操作。
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