摘要:
A method for forming a metal interconnection layer of a semiconductor device comprises forming a film including a material selective to a medium used in an ashing process on an interlayer insulating film. The method comprises transforming the film during the ashing process to form an interconnection pattern having a dual damascene structure. A dielectric material such as copper is deposited on the interconnection pattern, which is planarized through CMP, thereby forming a via contact having a single damascene structure without a recess therein.
摘要:
A visible-light wireless communication system includes a plurality of light transmitters for generating light signals modulated at different frequencies and at least one terminal for wirelessly communicating with the plurality of light transmitters using the light signals.
摘要:
A fusing device of an electrophotographic image forming apparatus includes a tubular internal pipe sealed at its ends to maintain a predetermined internal pressure to accommodate a predetermined amount of a working fluid in its inner space, a heater installed to wrap the internal pipe to generate heat, a power supply unit electrically connected to the heater to supply an external power to the heater, a cylindrical roller installed to wrap the heater, and end caps installed at both ends of the cylindrical roller. Each of the end caps includes a large-diameter portion in which an electrode electrically connected to the power supply unit is to be installed, and a small-diameter portion fittingly fixed to the end of the cylindrical roller by a locking unit. The fusing device has the end caps at both ends of a fusing roller to supply securely electricity from the power supply unit to the heater supplying heat to the fusing roller, thereby providing a maximized durability and operating safety to the fusing roller.
摘要:
A structurally improved fusing roller assembly based on the heat pipe principle is provided. The fusing roller assembly includes a fusing roller and a heat pipe coaxially mounted inside the fusing roller. A resistance heater is helically wound around the exterior cylindrical surface of the heat pipe, and rests between the inner cylindrical surface of the fusing roller and the exterior cylindrical surface of the heat pipe. The heat pipe is hermetically sealed with a quantity of a working fluid contained inside. The surface of fusing roller can be instantaneously heated up to a target fusing temperature. The fusing roller assembly can be heated up to a target fusing temperature within a shorter period of time without need for warm-up and stand-by period, so that power consumption decreases.
摘要:
A structurally improved fusing roller assembly based on the heat pipe principle is provided. The fusing roller assembly includes a fusing roller and a heat pipe coaxially mounted inside the fusing roller. A resistance heater is helically wound around the exterior cylindrical surface of the heat pipe, and rests between the inner cylindrical surface of the fusing roller and the exterior cylindrical surface of the heat pipe. The heat pipe is hermetically sealed with a quantity of a working fluid contained inside. The surface of fusing roller can be instantaneously heated up to a target fusing temperature. The fusing roller assembly can be heated up to a target fusing temperature within a shorter period of time without need for warm-up and stand-by period, so that power consumption decreases.
摘要:
A structurally improved fusing roller assembly based on a heat pipe principle is provided. The fusing roller assembly includes a fusing roller that serves as a heat pipe, and a resistance heater and/or a halogen lamp inside the fusing roller, so that the surface of the fusing roller can be instantaneously heated up to a target fusing temperature. The fusing roller assembly can be heated up to a target fusing temperature within a shorter period of time without need for a warm-up period and a stand-by period, so that power consumption decreases.
摘要:
Example embodiments of the present invention relate to a semiconductor device and a method of fabricating the same. Other example embodiments of the present invention relate to a semiconductor device having a metal silicide layer of a substrate and a barrier metal layer constituting a line layer and a method of fabricating the same. The semiconductor device may include a bar-type contact structure (e.g., a contact surface with an active region is bar shaped) and a dot-type contact structure (e.g., the contact surface is dot shaped). The bar-type contact structure may have a larger contact area with the active region. The bar-type contact structure may retard or prevent an ohmic contact layer, which is formed by the chemical combination of a barrier metal layer and a substrate between which a semiconductor layer is interposed, from being extended outside source/drain regions or being electrically shorted to a gate electrode. A contact hole exposing the substrate in a dot shape may be formed after the semiconductor layer is formed on the active region exposed in a bar shape.
摘要:
A power supply unit for a fusing roller of an electrophotographic image forming apparatus, which is electrically connected to a heat-generating portion for generating heat to raise the temperature of the fusing roller to an appropriate level at which a toner image is fused and for transmitting electric current from an external power source to the heat-generating portion, includes: a connecting portion installed at a center of each of two end caps fit around ends of the fusing roller and electrically connected to the heat-generating portion; a holder connected to the connecting portion, the holder installed in a frame, the frame supporting or mounting the fusing roller, and an elastic unit for providing elastic force to make the holder elastically contact the connecting portion. The power supply unit provides improved durability and operating safety under electrical and mechanical stresses caused by current, residual heat and thermal impacts.
摘要:
A fusing roller of an electrophotographic image forming apparatus is provided. The fusing roller includes an internal pipe having enclosed both ends in which a vacuum state of predetermined pressure is maintained and a predetermined amount of working fluid is stored, a fusing portion installed to surround the internal pipe, and a heating portion comprised of a helical resistance heating coil which is installed between the fusing portion and the internal pipe and generates heat. The distance between windings becomes smaller at the ends of the fusing roller than at the center to compensate for the higher dissipation of heat at the ends of the fusing roller than at the center. The result is a fusing roller that can quickly heat up and that has a uniform temperature along the surface of the fusing roller from end to end.
摘要:
A fusing device for an electrophotographic image forming apparatus includes: a heat pipe having a tubular shape and containing a predetermined amount of working fluid, the heat pipe being hermetically sealed at both of its ends; a fusing roller surrounding the heat pipe; a heater spirally installed between the fusing roller and the heat pipe for generating heat; and a power connecting unit for transmitting external electric power to the heater. The heater includes: a resistive coil for generating heat using the electric power transmitted by the power connecting unit; an insulation layer covering the resistive coil; a metal layer surrounding the insulation layer; and leads for connecting the resistive coil to the power connecting unit at both ends of the heater. Accordingly, the fusing roller uses the heat pipe, thereby reducing warm-up time for initial operation. In addition, use of the leads acting as a heat sink secures the reliability of the heater in the fusing device