专利检索 ap:("Jakob Ehrensvard" OR "Leif Henrik Eriksson" OR "Vilhelm Lindman") AND inv:"Vilhelm Lindman" 第 1 页

1.

发明申请
Use Of Heat-Activated Adhesive For Manufacture And A Device So Manufactured 审中-公开
标题翻译：用于制造的热活性粘合剂和如此制造的装置

公开(公告)号：US20080191174A1

公开(公告)日：2008-08-14

申请号：US11994939

申请日：2006-06-22

申请人： Jakob Ehrensvard , Leif Henrik Eriksson , Vilhelm Lindman

发明人： Jakob Ehrensvard , Leif Henrik Eriksson , Vilhelm Lindman

IPC分类号： C09J9/02

CPC分类号： H05K3/323 , C09J9/02 , H01R4/04 , H05K1/0275 , H05K3/245 , H05K3/361 , H05K3/4685 , H05K2201/0129 , H05K2201/055 , H05K2203/0759 , H05K2203/1105

摘要： The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.

摘要翻译： 本发明基于使用热活化粘合剂来制造包括印刷导电电子器件在内的柔性基底上的智能装置，其中粘合剂是各向异性导电粘合剂，并且作为薄膜施加到基底上，该薄膜可用于电连接并为印刷导电电子器件提供机械稳定性。