公开(公告)号：US5248476A

公开(公告)日：1993-09-28

申请号：US876407

申请日：1992-04-30

申请人： James A. Slattery ,  Charles E. T. White ,  George E. Kraeger ,  John R. Sovinsky

发明人： James A. Slattery ,  Charles E. T. White ,  George E. Kraeger ,  John R. Sovinsky

IPC分类号： C22C12/00 ,  C22C30/04

CPC分类号： C22C12/00 ,  C22C30/04

摘要： An alloy composition comprising effective amounts of bismuth, indium, lead, tin, and gallium, which is especially suited for lens blocking.

公开(公告)号：US5455004A

公开(公告)日：1995-10-03

申请号：US264186

申请日：1994-06-22

申请人： James A. Slattery ,  John R. Sovinsky

发明人： James A. Slattery ,  John R. Sovinsky

IPC分类号： B23K35/26 ,  C22C13/00 ,  C22C13/02

CPC分类号： C22C13/00 ,  B23K35/262

摘要： A lead-free alloy suitable for soldering comprising from about 82% to about 90% tin, from about 4.5% to about 6% zinc, from about 3.5% to about 6% indium and from about 1% to about 5% bismuth. The melting temperature of the alloy is preferably below 190.degree. C. and the alloy preferably has a pasty range of less than 10.degree. C.

摘要翻译： 适用于焊接的无铅合金，包括约82％至约90％的锡，约4.5％至约6％的锌，约3.5％至约6％的铟和约1％至约5％的铋。 合金的熔融温度优选低于190℃，合金优选具有小于10℃的糊状范围。