Wafer for electronic components
    1.
    发明授权

    公开(公告)号:US12249530B2

    公开(公告)日:2025-03-11

    申请号:US17719388

    申请日:2022-04-13

    Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

    LIGHT-EMITTING ELEMENT AND ELECTRONIC DEVICE

    公开(公告)号:US20220165916A1

    公开(公告)日:2022-05-26

    申请号:US17455708

    申请日:2021-11-19

    Abstract: According to one embodiment, a lighting-emitting element includes a light-emitting portion, a first terminal electrode and a second terminal electrode. The first terminal electrode includes a first cavity portion at a position overlapping a first connection electrode in planar view when the first terminal electrode is brought into contact with the first connection electrode. The second terminal electrode includes a second cavity portion at a position overlapping a second connection electrode in planar view when the second terminal electrode is brought into contact with the second connection electrode.

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