Deposition device and deposition method

    公开(公告)号:US11958073B2

    公开(公告)日:2024-04-16

    申请号:US18151482

    申请日:2023-01-09

    CPC classification number: B05D1/60 B05D1/36 H10K71/16 B05D2401/33

    Abstract: According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.

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