Ohmic contact using binder paste with semiconductor material dispersed
therein
    1.
    发明授权
    Ohmic contact using binder paste with semiconductor material dispersed therein 失效
    使用分散有半导体材料的粘合剂糊剂进行欧姆接触

    公开(公告)号:US5557146A

    公开(公告)日:1996-09-17

    申请号:US091648

    申请日:1993-07-14

    摘要: An ohmically conductive contact for a thin film p-type semiconductor compound formed of at least one of the metal elements of Class IIB of the Periodic Table of Elements and at least one of the non-metal elements of Class VIA of the Periodic Table of Elements and photovoltaic devices incorporating such contacts. An ohmic contact, according to the invention, includes a layer of conductive binder paste having mercury telluride and/or copper telluride dispersed therein. The invention also relates to a method of forming such ohmic contacts.

    摘要翻译: 由元素周期表的IIB族的金属元素中的至少一种形成的薄膜p型半导体化合物的欧姆导电接触和元素周期表VIA族的至少一种非金属元素 和包含这种触点的光伏器件。 根据本发明的欧姆接触包括具有分散在其中的碲化汞和/或碲化铜的导电粘合剂糊剂层。 本发明还涉及一种形成这种欧姆接触的方法。