PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF
    1.
    发明申请
    PHASE CHANGE MEMORY DEVICE AND FABRICATION THEREOF 审中-公开
    相变存储器件及其制造方法

    公开(公告)号:US20120068147A1

    公开(公告)日:2012-03-22

    申请号:US13304187

    申请日:2011-11-23

    IPC分类号: H01L47/00

    摘要: A method for forming a phase change memory device is disclosed. A substrate with a bottom electrode thereon is provided. A heating electrode and a dielectric layer are formed on the bottom electrode, wherein the heating electrode is surrounded by the dielectric layer. The heating electrode is etched to form recess in the dielectric layer. A phase change material is deposited on the dielectric layer, filling into the recess. The phase change material is polished to remove a portion of the phase change material exceeding the surface of the dielectric layer and a phase change layer is formed confined in the recess of the dielectric layer. A top electrode is formed on the phase change layer and the dielectric layer.

    摘要翻译: 公开了一种形成相变存储器件的方法。 提供具有底部电极的基板。 在底部电极上形成加热电极和电介质层,其中加热电极被电介质层包围。 蚀刻加热电极以在电介质层中形成凹陷。 相变材料沉积在介电层上,填充到凹槽中。 抛光相变材料以除去超过介电层表面的一部分相变材料,并将相变层限制在电介质层的凹槽中。 在相变层和电介质层上形成顶部电极。