公开(公告)号：US06530103B2

公开(公告)日：2003-03-11

申请号：US09886810

申请日：2001-06-21

申请人： Jeng-Yang Pan ,  Chia-Chun Wu ,  Wen-Fang Tang ,  Su-Yu Yeh ,  Huai-Tei Yang

发明人： Jeng-Yang Pan ,  Chia-Chun Wu ,  Wen-Fang Tang ,  Su-Yu Yeh ,  Huai-Tei Yang

IPC分类号： B08B1102

CPC分类号： B08B1/04 ,  B08B3/02 ,  Y10T279/11

摘要： A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

摘要翻译： 公开了一种通过晶片传送垫和用于进行这种方法的装置在研磨装置中的晶片转移处理期间消除晶片断裂的方法。 在该方法中，首先通过旋转刷和清洁溶剂喷雾来清洁由烧结陶瓷形成的真空垫或晶片传送垫的表面。 本发明还公开了一种用于通过结合位于真空管道中的压力调节阀，通过真空垫在晶片转移过程中消除晶片断裂的装置，使得施加的真空压力可以以不高于30psi / sec的速率进行调节。 到晶片传送垫的表面。