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    Substrate holder assembly for controlled layer transfer
    2.
    发明授权
    Substrate holder assembly for controlled layer transfer 有权
    用于受控层转移的基板支架组件

    公开(公告)号：US09502278B2

    公开(公告)日：2016-11-22

    申请号：US13867441

    申请日：2013-04-22

    申请人： International Business Machines Corporation

    发明人： Stephen W. Bedell ,  Keith E. Fogel ,  Paul A. Lauro ,  Devendra K. Sadana

    IPC分类号： H01L21/00 ,  H01L21/687 ,  B25B11/00 ,  H01L21/683 ,  B25B5/06 ,  B25B5/10 ,  H01L21/304

    CPC分类号： H01L21/68714 ,  B25B5/061 ,  B25B5/10 ,  B25B11/005 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/6875 ,  H01L2221/683 ,  H01L2221/68381 ,  Y10T225/10 ,  Y10T279/11 ,  Y10T279/23

    摘要： A substrate holder assembly for use in a controlled spalling process is provided. The substrate holder assembly includes a base structure having a surface in which a base substrate or other work piece can be placed thereupon. A framing element is located above and spaced apart from the surface of the base structure. The framing element has a window which exposes an upper surface of the base substrate and defines an area of the upper surface of the base substrate in which another material can be applied thereto. A support structure containing at least one mechanical securing element is located on the framing element. The support structure mechanically constrains the base substrate within the substrate holder assembly. Each mechanical securing element contacts at least one surface of the support structure and, optionally, one surface of the base substrate.

    摘要翻译： 提供了一种用于受控剥落过程的衬底保持器组件。 衬底保持器组件包括具有其中可以放置基底衬底或其它工件的表面的基底结构。 框架元件位于基部结构的表面上方并与之隔开。 框架元件具有露出基底基板的上表面并限定可以向其施加另一材料的基底基板的上表面的区域的窗口。 包含至少一个机械固定元件的支撑结构位于框架元件上。 支撑结构在衬底保持器组件内机械约束基底。 每个机械固定元件接触支撑结构的至少一个表面，并且可选地接触基底基板的一个表面。

    MULTI-SIZE ADAPTABLE SPIN CHUCK SYSTEM
    4.
    发明申请
    MULTI-SIZE ADAPTABLE SPIN CHUCK SYSTEM 审中-公开
    多尺寸适配旋钮系统

    公开(公告)号：US20150336127A1

    公开(公告)日：2015-11-26

    申请号：US14716143

    申请日：2015-05-19

    申请人： Brewer Science Inc.

    发明人： Kirk Emory ,  Brandon Wilson ,  Roger Ruesing

    IPC分类号： B05C5/02

    CPC分类号： H01L21/68785 ,  B05C11/08 ,  B05C13/02 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715 ,  H01L21/68792 ,  Y10T29/50 ,  Y10T279/11

    摘要： A novel interchangeable spin chuck system is provided that allows the user to quickly change substrate sizes and spin chuck styles without any extra tools. This system has a two-piece design and overcomes many of the drawbacks of previous spin chuck designs, such as difficulty in seating the spin chuck and ensuring that the spin chuck is at a consistent flatness and height. Furthermore, this spin chuck system allows the spin chucks to be manufactured at a lower cost. Thus, rather than restricting users to “make do” with incorrect spin chucks due to budget limitations, this economical design gives users access to a wider range of spin chuck sizes and styles.

    摘要翻译： 提供了一种新颖的可互换旋转卡盘系统，其允许用户快速地改变基板尺寸和旋转卡盘样式，而无需任何额外的工具。 该系统具有两件式设计，并克服了以前的旋转卡盘设计的许多缺点，例如难以安置旋转卡盘并确保旋转卡盘处于一致的平坦度和高度。 此外，该旋转卡盘系统允许以更低的成本制造旋转卡盘。 因此，由于预算的限制，这种经济的设计使用户不必限制使用错误的旋转卡盘“做”，用户可以访问更广泛的旋转卡盘尺寸和样式。

    SUBSTRATE SUPPORTING APPARATUS
    5.
    发明申请
    SUBSTRATE SUPPORTING APPARATUS 审中-公开
    基板支持设备

    公开(公告)号：US20150325466A1

    公开(公告)日：2015-11-12

    申请号：US14647729

    申请日：2012-11-27

    申请人： ACM RESEARCH (SHANGHAI) INC.

    发明人： Hui Wang ,  Fuping Chen ,  Huaidong Zhang ,  Wenjun Wang

    IPC分类号： H01L21/687 ,  H01L21/683 ,  H01L21/67

    CPC分类号： H01L21/6838 ,  B23B31/307 ,  H01L21/67259 ,  H01L21/68728 ,  H01L21/6875 ,  Y10T279/11

    摘要： A substrate supporting apparatus includes a rotatable chuck, a first mass flow controller, a second mass flow controller, a plurality of locating pins and guiding pillars, and a motor in which the rotatable chuck defines a plurality of first injecting ports and second injecting ports, the first injecting ports are connected with a first gas passage for supplying gas to the substrate and sucking the substrate by Bernoulli effect, the second injecting ports are connected with a second gas passage for supplying gas to the substrate and lifting the substrate, the first and the second mass flow controllers are respectively installed on the first and the second gas passages, the plurality of locating pins and guiding pillars are disposed at the top surface of the rotatable chuck and every guiding pillar protrudes to form a holding portion, and the motor is used for rotating the rotatable chuck.

    摘要翻译： 基板支撑装置包括可旋转卡盘，第一质量流量控制器，第二质量流量控制器，多个定位销和引导柱，以及电动机，其中可旋转卡盘限定多个第一注入口和第二注入口， 第一注入口与第一气体通道连接，用于向衬底供应气体并通过伯努利效应吸附衬底，第二注入口与用于向衬底供应气体并提升衬底的第二气体通道连接，第一和第 第二质量流量控制器分别安装在第一和第二气体通道上，多个定位销和引导柱设置在可旋转卡盘的顶表面处，并且每个引导柱突出以形成保持部分，并且电动机 用于旋转可旋转卡盘。

    System and Method for Non-Contact Wafer Chucking
    6.
    发明申请
    System and Method for Non-Contact Wafer Chucking 有权
    非接触式硅片卡盘的系统和方法

    公开(公告)号：US20150179495A1

    公开(公告)日：2015-06-25

    申请号：US14571000

    申请日：2014-12-15

    申请人： KLA-Tencor Corporation

    发明人： Luping Huang

    IPC分类号： H01L21/683 ,  G01N21/13 ,  G01N21/95 ,  B23B31/30

    CPC分类号： H01L21/6838 ,  G01N21/9503 ,  G01N2021/8461 ,  H01L21/68728 ,  Y10T29/49998 ,  Y10T279/11

    摘要： A non-contact wafer chucking apparatus includes a wafer chuck and a gripper assembly coupled to a portion of the wafer chuck. The wafer chuck includes pressurized gas elements configured to generate pressurized gas regions across a surface of the wafer chuck suitable for elevating the wafer above the surface of the wafer chuck. The wafer chuck further includes vacuum elements configured to generate reduced pressure regions across the surface of the wafer chuck having a pressure lower than the pressurized gas regions. The reduced pressure regions are suitable for securing the wafer above the wafer chuck without contact to the wafer chuck. The chucking apparatus includes a rotational drive unit configured to selectively rotate the wafer chuck. The gripper elements are reversibly couplable to an edge portion of the wafer so as to secure the wafer such that the wafer and gripper assembly rotate synchronously with the wafer chuck.

    摘要翻译： 非接触式晶片夹持装置包括与晶片卡盘的一部分耦合的晶片卡盘和夹持器组件。 晶片卡盘包括加压气体元件，其构造成在晶片卡盘的表面上产生加压气体区域，其适于将晶片升高到晶片卡盘的表面之上。 晶片卡盘还包括被配置为在晶片卡盘的表面上产生压力低于加压气体区域的压力的真空元件。 减压区域适用于将晶片固定在晶片卡盘上方而不与晶片卡盘接触。 夹持装置包括旋转驱动单元，其构造成选择性地旋转晶片卡盘。 夹持器元件可逆地联接到晶片的边缘部分，以便固定晶片，使得晶片和夹持器组件与晶片卡盘同步旋转。

    Controlled surface roughness in vacuum retention
    7.
    发明授权
    Controlled surface roughness in vacuum retention 有权
    真空保持中的受控表面粗糙度

    公开(公告)号：US08960686B2

    公开(公告)日：2015-02-24

    申请号：US13250871

    申请日：2011-09-30

    申请人： Robert A. Ferguson

    发明人： Robert A. Ferguson

    IPC分类号： H01L21/683 ,  B23Q3/08

    CPC分类号： B23Q3/088 ,  Y10S414/141 ,  Y10T279/11 ,  Y10T279/34

    摘要： An apparatus, particularly a chuck for retaining a thin part for micro-machining processing, is disclosed. The chuck is formed of a plate-shaped body having a first surface and a second surface opposite the first surface. The plate-shaped body includes a light-transmissive material, and at least one of the first surface or the second surface is a roughened surface. The chuck can be incorporated into a micro-machining system using a chuck support that allows light through to backlight a processed part for inspection.

    摘要翻译： 公开了一种装置，特别是用于保持用于微加工加工的薄部件的卡盘。 卡盘由具有第一表面和与第一表面相对的第二表面的板状主体形成。 板状主体包括透光材料，第一表面或第二表面中的至少一个是粗糙表面。 卡盘可以使用卡盘支撑件结合到微加工系统中，该卡盘支撑件允许光通过背光处理部件进行检查。

    DEVICE FOR HOLDING A PLANAR SUBSTRATE
    8.
    发明申请
    DEVICE FOR HOLDING A PLANAR SUBSTRATE 有权
    用于保持平面基板的装置

    公开(公告)号：US20140191478A1

    公开(公告)日：2014-07-10

    申请号：US14130349

    申请日：2012-07-02

    申请人： Alexander Oremus

    发明人： Alexander Oremus

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6838 ,  H01L21/67376 ,  H01L21/687 ,  H01L21/68714 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/6875 ,  Y10T279/11

    摘要： A device (1) for holding a planar substrate (4), in particular for a wafer or an eWLB, is shown, with a support (2) which forms a supporting surface (3) for the substrate (2) and has at least one recess (5) provided in the region of the supporting surface (3) for the substrate (2), and with at least one holding means which is connected in terms of flow to said recess (6) and is intended for fixing the substrate (2) on the device (1) with the aid of a vacuum generated between the support (2) and substrate (4). In order to be able to grip a multiplicity of substrates of geometrically differing profile, it is proposed that the support (2) has at least one recess (6) with an elastic seal (7) which is designed to be movable from a position (9) protruding over the edge (8) of the recess (6) into a position (10) pulled back in relation to the edge (8) of the recess (6) or at most corresponding to said edge and which interacts with the recess (5) for sucking the full area of the substrate (4) onto the support (2).

    摘要翻译： 示出了用于保持平面基板（4）的装置（1），特别是用于晶片或eWLB的平面基板（4），其具有形成用于基板（2）的支撑表面（3）的支撑件（2），并且至少具有 设置在用于基板（2）的支撑表面（3）的区域中的一个凹部（5），以及至少一个保持装置，其以流动方式连接到所述凹部（6）并用于固定基板 （2）在所述支撑件（2）和所述基板（4）之间产生的真空的帮助下在所述装置（1）上。 为了能够夹持多个几何不同轮廓的基底，提出了支撑件（2）具有至少一个具有弹性密封件（7）的凹部（6），弹性密封件（7）被设计成可从位置 9）突出到凹部（6）的边缘（8）上，使其相对于凹部（6）的边缘（8）被拉回或最多对应于所述边缘并与凹部相互作用的位置（10） （5），用于将基板（4）的整个区域吸附到支撑件（2）上。

    High temperature vacuum chuck assembly
    9.
    发明授权
    High temperature vacuum chuck assembly 有权
    高温真空吸盘组件

    公开(公告)号：US08698048B2

    公开(公告)日：2014-04-15

    申请号：US13456455

    申请日：2012-04-26

    申请人： Alexander N. Lerner ,  Blake Koelmel ,  Mehran Behdjat

    发明人： Alexander N. Lerner ,  Blake Koelmel ,  Mehran Behdjat

    IPC分类号： F27B5/06 ,  F27D5/00 ,  H01L21/68 ,  H01L21/683

    CPC分类号： B25B11/005 ,  H01L21/67109 ,  H01L21/6838 ,  H01L21/6875 ,  H01L21/68785 ,  H01L21/68792 ,  Y10T279/11

    摘要： A vacuum chuck and a process chamber equipped with the same are provided. The vacuum chuck assembly comprises a support body, a plurality of protrusions, a plurality of channels, at least one support member supporting the support body, at least one resilient member coupled with the support member, a hollow shaft supporting the support body, at least one electrical connector disposed through the hollow shaft, and an air-cooling apparatus. The support body has a support surface for holding a substrate (such as a wafer) thereon. The protrusions are formed on and project from the support surface for creating a gap between the substrate and the support surface. The channels are formed on the support surface for generating reduced pressure in the gap. The air-cooling apparatus is used for providing air cooling in the vicinity of the electrical connector.

    摘要翻译： 提供了一个真空吸盘和一个装有它的处理室。 真空吸盘组件包括支撑体，多个突起，多个通道，支撑支撑体的至少一个支撑构件，与支撑构件联接的至少一个弹性构件，至少支撑支撑体的中空轴 通过中空轴设置的一个电连接器和空气冷却装置。 支撑体具有用于在其上保持基板（例如晶片）的支撑表面。 突起形成在支撑表面上并从支撑表面突出，以在基板和支撑表面之间形成间隙。 通道形成在支撑表面上，用于在间隙中产生减压。 空气冷却装置用于在电连接器附近提供空气冷却。