公开(公告)号：US5120578A

公开(公告)日：1992-06-09

申请号：US737352

申请日：1991-07-29

申请人： Jensheng Chen ,  Philip D. Knudsen

发明人： Jensheng Chen ,  Philip D. Knudsen

IPC分类号： C23C18/30 ,  H05K3/18 ,  H05K3/38

CPC分类号： C23C18/30 ,  H05K3/181 ,  H05K3/387

摘要： The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

摘要翻译： 本发明公开了一种新的化学镀催化剂及其选择性镀覆方法。 催化剂和工艺特别适用于形成电子部件的EMI屏蔽。 化学镀催化剂包含分散在液体成膜组合物中的颗粒，其中微粒被氧化还原成与化学镀溶液接触的催化金属。

公开(公告)号：US5076841A

公开(公告)日：1991-12-31

申请号：US531440

申请日：1990-05-31

申请人： Jensheng Chen ,  Philip D. Knudsen

发明人： Jensheng Chen ,  Philip D. Knudsen

IPC分类号： C23C18/30 ,  H05K3/18 ,  H05K3/38

CPC分类号： C23C18/30 ,  H05K3/181 ,  H05K3/387

摘要： The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

摘要翻译： 本发明公开了一种新的化学镀催化剂及其选择性镀覆方法。 催化剂和工艺特别适用于形成电子部件的EMI屏蔽。 化学镀催化剂包含分散在液体成膜组合物中的颗粒，其中微粒被氧化还原成与化学镀溶液接触的催化金属。