公开(公告)号：US20130140546A1

公开(公告)日：2013-06-06

申请号：US13752911

申请日：2013-01-29

申请人： Ji Yeon LEE ,  Mi Sun KIM ,  Kil Sung LEE ,  Min Haeng CHO ,  Kie Hyun NAM ,  Jung Woo MOON ,  Ji Sil LEE

发明人： Ji Yeon LEE ,  Mi Sun KIM ,  Kil Sung LEE ,  Min Haeng CHO ,  Kie Hyun NAM ,  Jung Woo MOON ,  Ji Sil LEE

IPC分类号： H01L51/52

CPC分类号： H01L51/5259 ,  H05B33/04 ,  Y10T428/249953 ,  Y10T428/249978 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T442/2484

摘要： A hygroscopic filler for an organic EL getter, a method of manufacturing the same, and an organic EL device including the same, the hygroscopic filler including a sheet having pores; and a mixture of an organic binder and a hygroscopic material, the mixture being secured to the sheet.

摘要翻译： 用于有机EL吸气剂的吸湿填料，其制造方法和包含该吸湿剂的有机EL装置，该吸湿性填料包括具有孔的片; 以及有机粘合剂和吸湿材料的混合物，该混合物固定在片材上。

公开(公告)号：US20130140545A1

公开(公告)日：2013-06-06

申请号：US13752696

申请日：2013-01-29

申请人： Mi Sun KIM ,  Ji Yeon LEE ,  Kil Sung LEE ,  Min Haeng CHO ,  Kie Hyun NAM ,  Jung Woo MOON ,  Ji Sil LEE

发明人： Mi Sun KIM ,  Ji Yeon LEE ,  Kil Sung LEE ,  Min Haeng CHO ,  Kie Hyun NAM ,  Jung Woo MOON ,  Ji Sil LEE

IPC分类号： H01L51/00 ,  C08K3/22 ,  H01L51/52 ,  B32B5/28

CPC分类号： C08K3/22 ,  C08K9/08 ,  C08K2003/2206 ,  H01L51/524 ,  H01L51/5259 ,  Y10T442/20

摘要： A moisture absorption filling material for an organic light-emitting device may include a fibrous web structure including an assembly of fibers, the fibers including a binder resin and hygroscopic particles, the hygroscopic particles being secured into the fibers. A method of preparing a moisture absorption filling material for an organic light-emitting device may include electrospinning a mixture including about 10 wt % to about 60 wt % of hygroscopic particles and about 40 wt % to about 90 wt % of a binder.

摘要翻译： 用于有机发光装置的吸湿填充材料可以包括纤维网结构，其包括纤维组合，所述纤维包括粘合剂树脂和吸湿颗粒，吸湿颗粒被固定在纤维中。 制备用于有机发光装置的吸湿填充材料的方法可以包括静电纺丝，其包含约10重量％至约60重量％的吸湿颗粒和约40重量％至约90重量％的粘合剂。

公开(公告)号：US20100213828A1

公开(公告)日：2010-08-26

申请号：US12691778

申请日：2010-01-22

申请人： Sang-Joon SEO ,  Kie Hyun NAM ,  Jung-Woo MOON

发明人： Sang-Joon SEO ,  Kie Hyun NAM ,  Jung-Woo MOON

IPC分类号： H01J1/62 ,  H01J9/24

CPC分类号： H01L51/5259 ,  H01L27/3244 ,  H01L51/5253

摘要： An OLED display that includes a substrate main body, an OLED formed on the substrate main body, a moisture absorbing layer formed on the substrate main body and covering the OLED, an organic barrier layer formed on the substrate main body and covering the moisture absorbing layer, and an inorganic barrier layer formed on the substrate main body and covering the organic barrier layer.

摘要翻译： 一种OLED显示器，包括基板主体，形成在基板主体上的OLED，形成在基板主体上并覆盖OLED的吸湿层，形成在基板主体上并覆盖吸湿层的有机阻挡层 ，以及形成在基板主体上并覆盖有机阻挡层的无机阻挡层。

公开(公告)号：US20120104420A1

公开(公告)日：2012-05-03

申请号：US13069254

申请日：2011-03-22

申请人： Jung-Min LEE ,  Choong-Ho LEE ,  Kie Hyun NAM

发明人： Jung-Min LEE ,  Choong-Ho LEE ,  Kie Hyun NAM

IPC分类号： H01L51/52

CPC分类号： H01L51/524 ,  B82Y10/00 ,  H01L27/3258 ,  H01L27/3276 ,  H01L51/0048 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/525

摘要： A display device includes a substrate, a display unit formed on the substrate, a sealing substrate bonded to the substrate by a bonding layer surrounding the display unit, the sealing substrate comprising a complex member and an insulating member, wherein the complex member has a resin matrix and a plurality of carbon fibers and the insulator is connected to an edge of the complex member and comprises a penetration hole, a metal layer disposed at one side of the sealing substrate wherein the one side faces the substrate, and a conductive connection unit filling in the penetration hole and contacting the metal layer. The complex member and the insulator may be coupled by tongue and groovecoupling along a thickness direction of the sealing substrate where the protrusion-groove coupling structure is top-to-bottom symmetric and the insulator may have a thickness identical to that of the complex member.

摘要翻译： 显示装置包括基板，形成在基板上的显示单元，通过围绕显示单元的接合层粘合到基板的密封基板，密封基板包括复合部件和绝缘部件，其中复合部件具有树脂 基体和多个碳纤维，绝缘体连接到复合构件的边缘，并且包括穿透孔，设置在密封基板的一侧的金属层，其中一侧面向基板，以及导电连接单元填充 在穿透孔中并与金属层接触。 复合构件和绝缘体可以沿着密封衬底的厚度方向通过舌和槽耦合来耦合，其中突出沟槽联接结构是从上到下对称的，并且绝缘体可以具有与复合构件的厚度相同的厚度。

公开(公告)号：US20100295031A1

公开(公告)日：2010-11-25

申请号：US12763426

申请日：2010-04-20

申请人： Sang Joon SEO ,  Kie Hyun NAM

发明人： Sang Joon SEO ,  Kie Hyun NAM

IPC分类号： H01L51/50 ,  H01L51/56

CPC分类号： H01L51/5256

摘要： An organic light emitting device and a method of manufacturing the same, the device including: a substrate; a barrier layer; a first electrode; a second electrode; and an organic layer interposed between the first electrode and the second electrode, wherein the barrier layer includes an SiO layer and an SiOxNy layer.

摘要翻译： 一种有机发光器件及其制造方法，所述器件包括：衬底; 阻挡层; 第一电极; 第二电极; 以及介于所述第一电极和所述第二电极之间的有机层，其中所述阻挡层包括SiO层和SiO x N y层。

公开(公告)号：US20110291119A1

公开(公告)日：2011-12-01

申请号：US13087288

申请日：2011-04-14

申请人： Do-Hyung RYU ,  Chun-Seok KO ,  Kie Hyun NAM

发明人： Do-Hyung RYU ,  Chun-Seok KO ,  Kie Hyun NAM

IPC分类号： H01L27/15

CPC分类号： H01L27/3276 ,  H01L51/5221 ,  H01L51/524

摘要： An organic light emitting diode display is disclosed. The organic light emitting diode display includes a base substrate including a display area and a non-display area around the display area, a plurality of pixels formed over the display area of the base substrate, the plurality of pixels including a common electrode, a common power line formed over the base substrate and electrically connected to a circuit of each of the plurality of pixels, an encapsulation substrate bonded to the base substrate by a sealing member surrounding the plurality of pixels, the encapsulation substrate including an inner surface facing the base substrate, a first conductive layer formed over the inner surface and electrically connecting the common power line to a first potential, and a second conductive layer formed over the inner surface and spaced apart from the first conductive layer, the second conductive layer electrically connecting the common electrode to a second potential.

摘要翻译： 公开了一种有机发光二极管显示器。 有机发光二极管显示器包括：基板，包括显示区域和显示区域周围的非显示区域;多个像素，形成在基板的显示区域上，多个像素包括公共电极，公共电极 电源线形成在所述基底基板上并电连接到所述多个像素中的每一个的电路，封装基板通过围绕所述多个像素的密封构件结合到所述基底基板，所述封装基板包括面向所述基板的内表面 ，形成在所述内表面上并将所述公用电源线电连接到第一电位的第一导电层和形成在所述内表面上并与所述第一导电层间隔开的第二导电层，所述第二导电层电连接所述公共电极 到第二个潜力。