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公开(公告)号:US20080287015A1
公开(公告)日:2008-11-20
申请号:US11961590
申请日:2007-12-20
申请人: Jin Hwan CHA , Hyun Soo JANG
发明人: Jin Hwan CHA , Hyun Soo JANG
IPC分类号: H01R33/00
CPC分类号: G07D11/0006 , H01R13/453 , H01R13/5213 , H01R2201/06
摘要: Disclosed is a connector cover structure of a bill storage box, which can prevent a connector for electric power supply from being exposed to dust or foreign substances, during the process of mounting or dismounting a cassette box in or from the bill storage box. The disclosed connector cover structure includes: a connector-fixing bracket fixedly assembled with the connector, and having assembling holes formed through opposite sides of the connector-fixing bracket; a cover having a hinge shaft rotatably fitted in the assembling holes of the connector-fixing bracket, thereby covering a connecting pin; a contact part protruded by a certain length in front of one end of the cover, and having a curved shape; and elastic springs fixedly assembled to the hinge shaft in such a manner that the cover can be returned to its original position. Accordingly, it is possible to prevent poor connection or electrical short circuiting by preventing the exposure of the connector to dust or foreign substances.
摘要翻译: 公开了一种在将盒式磁带盒装入或从纸币收纳箱安装或拆卸的过程中,能够防止电力供应用连接器暴露于灰尘或异物的纸币收纳箱的连接器盖结构。 所公开的连接器盖结构包括:与连接器固定组装的连接器固定支架,并具有通过连接器固定支架的相对侧形成的组装孔; 具有可旋转地装配在连接器固定支架的组装孔中的铰链轴的盖,从而覆盖连接销; 接触部分在盖的一端前方突出一定长度,并具有弯曲形状; 以及弹性弹簧以这样的方式固定地组装到铰链轴上,使得盖可以返回到其初始位置。 因此,通过防止连接器暴露于灰尘或异物,可以防止连接不良或电气短路。
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2.
公开(公告)号:US20130045331A1
公开(公告)日:2013-02-21
申请号:US13587061
申请日:2012-08-16
申请人: Woo Chan KIM , Jeong Ho LEE , Sang Jin JEONG , Hyun Soo JANG
发明人: Woo Chan KIM , Jeong Ho LEE , Sang Jin JEONG , Hyun Soo JANG
IPC分类号: C23C16/44
CPC分类号: C23C16/45527 , C23C16/45504 , C23C16/45548 , C23C16/4558 , C23C16/45591
摘要: A lateral flow atomic layer deposition (ALD) apparatus has two gas inflow channels and two gas outflow channels that are connected to two gas outlets that are symmetrically formed based on a substrate in which a thin film is deposited, thereby differently guiding a flow direction of a gas flowing on the substrate. Therefore, uniformity of a deposited film is improved, compared with the conventional lateral flow ALD apparatus in which a supplied source gas and reaction gas constantly flow in only one direction on the substrate.
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