Abstract:
An article of manufacture provides a compact assembly of power amplifiers in series and in parallel. A plurality of radial power splitters and radial power combiners couple surface mounted power amplifier dice into a power platter. Thermal conduction probes chained through the power platters remove heat from the vicinity of the power amplifier dice. Surface mounted power amplifier dice may be enclosed within a matched pair of power platters. Stackable power platters may be assembled to form a 3D power amplifier pile.
Abstract:
A peripheral apparatus includes an application program. The peripheral apparatus couples to the host system and automatically install the application program into the host system. Thus, the peripheral apparatus of the present invention does not need extra floppy disks or CD-ROM containing the application program. This aspect of the present invention is to avoid intervention for user, e.g., losing the floppy disks or CD-ROM.