公开(公告)号：US08643127B2

公开(公告)日：2014-02-04

申请号：US12196196

申请日：2008-08-21

申请人： John Dangtran ,  Roger Horton

发明人： John Dangtran ,  Roger Horton

IPC分类号： H01L29/84

CPC分类号： B81B7/0077 ,  B81B7/0019

摘要： A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

摘要翻译： 一种传感器装置和一种形成方法包括：芯片垫接收诸如MEMS器件的传感器装置。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 管芯焊盘包括基座和具有符合第一和第二CTE的CTE的支撑结构。 管芯焊盘具有从基部突出的支撑结构。 支撑结构具有高度和壁厚度，当底座经受来自头部的热膨胀或收缩力时，可以最大限度地减小芯片焊盘和MEMS器件感觉到的力。

公开(公告)号：US20070228499A1

公开(公告)日：2007-10-04

申请号：US11544089

申请日：2006-10-06

申请人： John Dangtran ,  Roger Horton

发明人： John Dangtran ,  Roger Horton

IPC分类号： H01L29/84

CPC分类号： B81B7/0048 ,  H01L2924/19105

摘要： A low cost micro-electronic package for MEMS applications includes a package substrate, a MEMS device and a buffer insert which is placed between the MEMS device and the package substrate. The buffer insert has a coefficient of thermal expansion (CTE) which is compatible with the material of the MEMS device and is sufficiently rigid to isolate the MEMS device from thermal, mechanical and other physical stresses applied to the package substrate. In an embodiment, the package is formed as an integrated device which includes both the MEMS device and a signal conditioning integrated circuit, potentially found in the same die. The substrate insert may be made of a material having a CTE value compatible with silicon (Si), such as Kovar, Invar, or an appropriate ceramic material or the like.

摘要翻译： 用于MEMS应用的低成本微电子封装包括封装衬底，MEMS器件和放置在MEMS器件和封装衬底之间的缓冲插入件。 缓冲插入件具有与MEMS器件的材料相容的热膨胀系数（CTE），并且具有足够的刚性以将MEMS器件与施加到封装衬底的热，机械和其他物理应力隔离。 在一个实施例中，封装被形成为集成器件，其包括MEMS器件和可能在同一管芯中发现的信号调节集成电路。 衬底插入物可以由具有与硅（Si）相容的CTE值的材料制成，例如Kovar，Invar或适当的陶瓷材料等。

公开(公告)号：US20100044809A1

公开(公告)日：2010-02-25

申请号：US12196196

申请日：2008-08-21

申请人： John Dangtran ,  Roger Horton

发明人： John Dangtran ,  Roger Horton

IPC分类号： H01L29/84 ,  H01L21/58

CPC分类号： B81B7/0077 ,  B81B7/0019

摘要： A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.

摘要翻译： 一种传感器装置和一种形成方法包括：芯片垫接收诸如MEMS器件的传感器装置。 MEMS器件具有第一热膨胀系数（CTE）。 芯片焊盘由具有与第一CTE兼容的第二CTE的材料制成。 管芯焊盘包括基座和具有符合第一和第二CTE的CTE的支撑结构。 管芯焊盘具有从基部突出的支撑结构。 支撑结构具有高度和壁厚度，当底座经受来自头部的热膨胀或收缩力时，能够最大限度地减小芯片焊盘和MEMS器件感觉到的力。

公开(公告)号：US20080099861A1

公开(公告)日：2008-05-01

申请号：US11975618

申请日：2007-10-19

申请人： John Dangtran

发明人： John Dangtran

IPC分类号： H01L29/84 ,  H01L21/00

CPC分类号： G01P1/023 ,  G01D11/245

摘要： A sensor device and a method of forming thereof comprises a die pad having an inner portion and an outer portion. The outer portion is made of steel, aluminum or other metal and is adapted to mount the die pad to a support structure having a first coefficient of thermal expansion (CTE) value and provide a hermetic seal therewith. The outer portion is made of a material having a CTE value substantially complaint with the first CTE value. The inner portion may be made of Invar, Kovar or ceramic material to receive a MEMS device having a second CTE value. The inner portion is made of a material having a CTE value substantially compliant with the second CTE value. The outer portion has a thickness less than that of the inner portion. The die pad may include a trench between outer edges of the outer and inner portions.

摘要翻译： 传感器装置及其形成方法包括具有内部部分和外部部分的管芯焊盘。 外部由钢，铝或其他金属制成，并且适于将管芯焊盘安装到具有第一热膨胀系数（CTE）值的支撑结构上并与其一起提供气密密封。 外部由具有基本上与第一CTE值相反的CTE值的材料制成。 内部部分可以由Invar，Kovar或陶瓷材料制成，以接收具有第二CTE值的MEMS器件。 内部部分由具有基本上符合第二CTE值的CTE值的材料制成。 外部部分的厚度小于内部部分的厚度。 管芯焊盘可以包括在外部部分和内部部分的外边缘之间的沟槽。