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1.发明授权公开(公告)号：US07408780B2
公开(公告)日：2008-08-05
申请号：US11151843
申请日：2005-06-14
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中弹簧元件中的至少一个包括弹簧部分和翅片部分。 至少一个弹簧元件提供来自电子设备的热路径并且提供机械顺应性。 在另一个实施例中，该结构还包括设置在电子设备上的导热层，其中至少一个弹簧元件中的每一个的翅片部分耦合到导热层。
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公开(公告)号：US07545648B2
公开(公告)日：2009-06-09
申请号：US12055263
申请日：2008-03-25
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.
摘要翻译： 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。
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公开(公告)号：US07362582B2
公开(公告)日：2008-04-22
申请号：US11151905
申请日：2005-06-14
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a compressible top layer disposed over the electronic device. The structure further includes a plurality of rigid elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of rigid elements provide mechanical compliance. In another alternative, the structure further includes a conformable heat-conducting layer disposed over the electronic device, wherein a bottom end of the plurality of rigid elements is coupled to the conformable heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的可压缩顶层。 该结构还包括设置在顶层和电子设备之间的多个刚性元件，用于提供来自电子设备的热路径，并且其中多个刚性元件提供机械顺应性。 在另一替代方案中，结构还包括设置在电子设备上的适形导热层，其中多个刚性元件的底端联接到适形导热层。
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公开(公告)号：US07545647B2
公开(公告)日：2009-06-09
申请号：US12037067
申请日：2008-02-25
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。
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公开(公告)号：US20080298016A1
公开(公告)日：2008-12-04
申请号：US12180711
申请日：2008-07-28
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A method for cooling an electronic device includes forming a spring structure by coupling a plurality of spring elements with a fin portion oriented at an angle, wherein a first end of the fin portion has a narrowed tip; coupling the spring structure with a planar heat-conducting material to form a first heat-conducting layer; positioning the first heat-conducting layer such that the planar heat-conducting material is on top; and placing the first heat-conducting layer over the electronic device such that the fin portion is oriented at an angle toward the electronic device, and such that the narrowed tip of the fin portion is in contact with the top surface of the electronic device.
摘要翻译： 一种用于冷却电子设备的方法包括：通过将多个弹簧元件与一个以一定角度取向的翅片部分联接来形成弹簧结构，其中，翅片部分的第一端具有变窄的尖端; 将弹簧结构与平面导热材料联接以形成第一导热层; 将第一导热层定位成使得平面导热材料位于顶部; 并且将第一导热层放置在电子设备上，使得翅片部分朝向电子设备成一定角度，并且使得翅片部分的变窄的尖端与电子设备的顶表面接触。
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公开(公告)号：US07355855B2
公开(公告)日：2008-04-08
申请号：US11151830
申请日：2005-06-14
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements provide mechanical compliance. In one alternative, the structure further includes a solid heat-conducting layer disposed over the electronic device, wherein the plurality of spring elements are coupled to the solid heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，用于从电子设备提供热路径，并且其中多个弹簧元件提供机械顺应性。 在一个替代方案中，该结构还包括设置在电子设备上的固体导热层，其中多个弹簧元件联接到固体导热层。
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公开(公告)号：US20080170370A1
公开(公告)日：2008-07-17
申请号：US12055263
申请日：2008-03-25
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.
摘要翻译： 一种信息处理系统，包括：处理器; 记忆 输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。 该系统还包括用于冷却处理器的冷却结构。 冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。
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公开(公告)号：US20080144288A1
公开(公告)日：2008-06-19
申请号：US12037067
申请日：2008-02-25
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的固体导热层。 固体导热层是与电子设备接触的平面。 该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中 多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大， 导电层。
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公开(公告)号：US07264041B2
公开(公告)日：2007-09-04
申请号：US11151831
申请日：2005-06-14
申请人： John P. Karidis , Mark Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark Schultz , Bucknell C. Webb
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one spring element comprises a spring portion, provides a heat path from the electronic device and provides mechanical compliance. The structure further includes a seal for containing a space between the top layer and the electronic device, wherein the space contained includes the plurality of spring elements, and a liquid with vaporizing capability disposed with the space contained.
摘要翻译： 公开了一种用于冷却电子设备的结构。 该结构包括设置在电子设备上的顶层。 该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中至少一个弹簧元件包括弹簧部分，提供来自电子设备的热路径并提供机械顺应性。 该结构还包括用于在顶层和电子设备之间容纳空间的密封件，其中容纳的空间包括多个弹簧元件，以及具有包含空间的蒸发能力的液体。
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公开(公告)号：US07268963B2
公开(公告)日：2007-09-11
申请号：US10903153
申请日：2004-07-30
CPC分类号： G11B5/59633 , G11B5/59605
摘要： Self-servo-writing of multi-slot timing patterns is described. Individual timing marks are replaced with groups of timing mark slots. At each timing mark location, a time measurement is made by detecting a timing mark in one of the slots. Also, extensions to the existing timing marks are written in other slots. The combination of timing measurements at every timing mark and extensions to those timing marks written at every opportunity improves the overall precision of the timing propagation. The improved accuracy of timing mark placement produces a commensurate improvement in the placement of the concomitantly written servo-data. In addition, the alignment accuracy of the written pattern is less sensitive to variations in rotation speed and variations in the shape of written transitions. Moreover, only a single disk revolution is required at each servo radius to write servo data and propagate the timing marks to maintain timing alignment.
摘要翻译： 描述了多时隙定时模式的自伺服写入。 单个定时标记被定时标记位置组替换。 在每个定时标记位置，通过检测其中一个时隙中的定时标记来进行时间测量。 此外，现有时序标记的扩展也写在其他插槽中。 每个定时标记的定时测量和在每个机会上写入的定时标记的扩展的组合可以提高定时传播的总体精度。 定时标记放置的改进精度在同时写入的伺服数据的位置上产生相应的改进。 此外，写入的图案的对准精度对旋转速度的变化和写入的转变的形状的变化较不敏感。 此外，在每个伺服半径处仅需要一次盘旋转以写入伺服数据并传播定时标记以保持定时对准。
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