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    Material transport systems including a transport belt having resistance to laser radiation damage and methods of cutting substrates in material transport systems with laser radiation
    1.
    发明授权
    Material transport systems including a transport belt having resistance to laser radiation damage and methods of cutting substrates in material transport systems with laser radiation 有权
    材料输送系统包括具有耐激光辐射损伤的输送带和用激光辐射在材料输送系统中切割基材的方法

    公开(公告)号：US08573390B2

    公开(公告)日：2013-11-05

    申请号：US12720065

    申请日：2010-03-09

    申请人： John R. Andrews ,  Richard R. Scarlata ,  Paul K. Robinson

    发明人： John R. Andrews ,  Richard R. Scarlata ,  Paul K. Robinson

    IPC分类号： B65G15/34

    CPC分类号： B65G15/38 ,  B23K26/0838 ,  B65G15/30 ,  B65G2207/22

    摘要： Material transport systems including a radiation-resistant transport belt and methods of cutting substrates transported in the material transport systems are provided. An exemplary material transport system includes a continuous transport belt entrained on at least a first roll and a second roll. The transport belt includes at least a first layer and a second layer over the first layer. The first layer includes an inner surface of the transport belt and the second layer includes an outer surface of the transport belt. The second layer can be comprised of copper, copper-based alloys, aluminum, aluminum-based alloys or nickel.

    摘要翻译： 提供了包括耐辐射输送带的材料输送系统和在材料输送系统中输送的基板的切割方法。 示例性材料输送系统包括夹带在至少第一辊和第二辊上的连续输送带。 传送带在第一层上至少包括第一层和第二层。 第一层包括传送带的内表面，第二层包括传送带的外表面。 第二层可以由铜，铜基合金，铝，铝基合金或镍组成。