-
公开(公告)号:US06209398B1
公开(公告)日:2001-04-03
申请号:US09156103
申请日:1998-09-17
IPC分类号: G01L912
CPC分类号: G01L19/141 , G01L19/0038 , G01L19/069
摘要: A fluid pressure transducer assembly (10) includes an exemplary silicon or ceramic capacitive transducer (22) having a relatively flexible diaphragm portion (22e) mounted on a ceramic substrate or circuit board (18) over a bore (18a) so that the diaphragm is exposed to fluid pressure from a port (12m) received through the bore. The circuit board is received in a plastic housing (12) laterally positioned by guides (12e, 12f) on three height control pins (12d) to vertically position the circuit board a defined, precise distance above a platform (12b) on which a bead of adhesive sealing material has previously been placed, the sealing material having a height greater than the distance between a plane in which the free end of the height control pins lie and a plane in which the top surface of the platform lies. As a result, the circuit board is sealed to the plastic housing through a bead having a uniform, precise height all around its circumference to isolate temperature expansion stresses. According to another feature of the invention an electrically conductive layer (30a) is formed on the top surface of the circuit board beneath the transducer (22) and another electrically conductive layer (30b) is formed on the top surface of the transducer (22) electrically joined together to form an EMI shield.
摘要翻译: 流体压力传感器组件(10)包括示例性硅或陶瓷电容换能器(22),其具有安装在孔(18a)上方的陶瓷衬底或电路板(18)上的相对柔性的膜部分(22e),使得隔膜是 暴露于通过孔接收的端口(12m)的流体压力。 电路板被容纳在由三个高度控制销(12d)上的引导件(12e,12f)横向定位的塑料外壳(12)中,以将电路板垂直定位在平台(12b)上方限定的精确距离,在平台 先前已经放置了粘合密封材料,密封材料的高度大于高度控制销的自由端所在的平面与平台顶面所在的平面之间的距离。 结果,电路板通过具有均匀,精确的高度的圆周在其周围密封到塑料壳体以隔离温度膨胀应力。 根据本发明的另一个特征,在换能器(22)下方的电路板的顶表面上形成导电层(30a),并且在换能器(22)的顶表面上形成另一个导电层(30b) 电连接在一起以形成EMI屏蔽。