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公开(公告)号：US08304861B2
公开(公告)日：2012-11-06
申请号：US13161102
申请日：2011-06-15
IPC分类号： H01L29/06
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US20110241176A1
公开(公告)日：2011-10-06
申请号：US13161102
申请日：2011-06-15
IPC分类号： H01L29/02
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US20110212563A1
公开(公告)日：2011-09-01
申请号：US13082834
申请日：2011-04-08
IPC分类号： H01L21/782
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
摘要翻译： 形成惯性传感器的方法提供1）具有二维阵列惯性传感器的装置晶片和2）第二晶片，并将铝/锗合金沉积到一个或两个晶片上。 合金被沉积并图案化以形成多个闭合环。 该方法然后对准器件晶片和第二晶片，然后将合金定位在晶片之间。 接下来，该方法熔化合金，然后固化合金以在多个惯性传感器周围形成多个导电密封环。 密封环将装置晶片连接到第二晶片。 最后，该方法切割晶片以形成多个单独的气密密封惯性传感器。
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4.发明授权公开(公告)号：US08293582B2
公开(公告)日：2012-10-23
申请号：US13161108
申请日：2011-06-15
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US08288191B2
公开(公告)日：2012-10-16
申请号：US13082834
申请日：2011-04-08
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
摘要翻译： 形成惯性传感器的方法提供1）具有二维阵列惯性传感器的装置晶片和2）第二晶片，并将铝/锗合金沉积到一个或两个晶片上。 合金被沉积并图案化以形成多个闭合环。 该方法然后对准器件晶片和第二晶片，然后将合金定位在晶片之间。 接下来，该方法熔化合金，然后固化合金以在多个惯性传感器周围形成多个导电密封环。 密封环将装置晶片连接到第二晶片。 最后，该方法切割晶片以形成多个单独的气密密封惯性传感器。
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6.发明申请公开(公告)号：US20110244630A1
公开(公告)日：2011-10-06
申请号：US13161108
申请日：2011-06-15
IPC分类号： H01L21/78
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US07981765B2
公开(公告)日：2011-07-19
申请号：US12434886
申请日：2009-05-04
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US07943411B2
公开(公告)日：2011-05-17
申请号：US12434772
申请日：2009-05-04
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
摘要翻译： 形成惯性传感器的方法提供1）具有二维阵列惯性传感器的装置晶片和2）第二晶片，并将铝/锗合金沉积到一个或两个晶片上。 合金被沉积并图案化以形成多个闭合环。 该方法然后对准器件晶片和第二晶片，然后将合金定位在晶片之间。 接下来，该方法熔化合金，然后固化合金以在多个惯性传感器周围形成多个导电密封环。 密封环将装置晶片连接到第二晶片。 最后，该方法切割晶片以形成多个单独的气密密封惯性传感器。
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公开(公告)号：US20100062565A1
公开(公告)日：2010-03-11
申请号：US12434886
申请日：2009-05-04
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译： 微芯片具有将第一基板结合到第二基板的接合材料。 接合材料尤其具有稀土金属和其它材料。
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公开(公告)号：US20100059835A1
公开(公告)日：2010-03-11
申请号：US12434772
申请日：2009-05-04
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
摘要翻译： 形成惯性传感器的方法提供1）具有二维阵列惯性传感器的装置晶片和2）第二晶片，并将铝/锗合金沉积到一个或两个晶片上。 合金被沉积并图案化以形成多个闭合环。 该方法然后对准器件晶片和第二晶片，然后将合金定位在晶片之间。 接下来，该方法熔化合金，然后固化合金以在多个惯性传感器周围形成多个导电密封环。 密封环将装置晶片连接到第二晶片。 最后，该方法切割晶片以形成多个单独的气密密封惯性传感器。
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