Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility
    1.
    发明授权
    Miniaturized acoustic boom structure for reducing microphone wind noise and ESD susceptibility 有权
    用于降低麦克风风噪声和ESD敏感性的小型化声臂结构

    公开(公告)号:US08208673B2

    公开(公告)日:2012-06-26

    申请号:US12114583

    申请日:2008-05-02

    摘要: A miniaturized acoustic boom structure includes a microphone boom housing having a wind screen and a microphone pod configured to hold a microphone. The microphone pod has an outer surface secured to an inner surface of the microphone boom housing, an interior having one or more surfaces configured to form an acoustic seal around at least a portion of the periphery of the microphone, and first and second pod port openings. The first and second pod port openings provide sound wave access to opposing sides of a diaphragm of the microphone, and are shaped and spaced away from the first and second microphone ports of the microphone so that an acoustic path length between the first and second pod port openings is greater than an acoustic path length between the first and second microphone ports.

    摘要翻译: 小型化的吊杆结构包括具有风屏的麦克风吊杆壳体和被构造成保持麦克风的麦克风盒。 麦克风盒具有固定到麦克风吊杆壳体的内表面的外表面,内部具有一个或多个表面,其被配置为围绕麦克风的周边的至少一部分形成声学密封,以及第一和第二吊舱孔口 。 第一和第二端口开口提供对麦克风的隔膜的相对侧的声波通路,并且与麦克风的第一和第二麦克风端口成形并间隔开,使得第一和第二端口之间的声路长度 开口大于第一和第二麦克风端口之间的声路长度。

    Dual mode earphone with acoustic equalization
    2.
    发明授权
    Dual mode earphone with acoustic equalization 有权
    双声道耳机,具有声学均衡

    公开(公告)号:US08111853B2

    公开(公告)日:2012-02-07

    申请号:US12170716

    申请日:2008-07-10

    申请人: Osman Kemal Isvan

    发明人: Osman Kemal Isvan

    IPC分类号: H04R1/20

    CPC分类号: H04R1/1091

    摘要: In one embodiment, a dual-mode earphone is provided, comprising a first earbud including a speaker with a diaphragm and at least one acoustic port in front of the diaphragm, and a cap in front of the speaker. The speaker or the cap is configured to move relative to the other for opening and closing the acoustic port in one embodiment and a movable seal is provided in another embodiment. The earphone further includes a second earbud housing operably coupled to the first earbud opposite the speaker. A method for providing acoustic equalization in a dual-mode earphone is also disclosed.

    摘要翻译: 在一个实施例中,提供了一种双模式耳机,其包括第一耳塞,其包括具有隔膜的扬声器和在隔膜前面的至少一个声学端口,以及扬声器前面的盖子。 在一个实施例中,扬声器或盖被配置为相对于另一个移动以打开和关闭声学端口,并且在另一个实施例中提供可移动密封件。 耳机还包括可操作地耦合到与扬声器相对的第一耳塞的第二耳塞外壳。 还公开了一种在双模式耳机中提供声学均衡的方法。