公开(公告)号：US20190353387A1

公开(公告)日：2019-11-21

申请号：US16011420

申请日：2018-06-18

Applicant: Johnson Controls Technology Company

Inventor： Neelkanth S. Gupte ,  Tejas Mahendra ,  Mukesh Sharma ,  Akshay Baljekar

IPC: F24F11/85 ,  F25B49/02 ,  F24F1/00

Abstract: Embodiments of the present disclosure are directed to a heating and cooling system includes a heat exchanger configured to place an airflow and a refrigerant in thermal communication with one another, where the heat exchanger has a coil and a plurality of fans coupled to the coil, and where the plurality of fans is arranged in an array adjacent to the coil.

公开(公告)号：US11137165B2

公开(公告)日：2021-10-05

申请号：US16011420

申请日：2018-06-18

Applicant: Johnson Controls Technology Company

Inventor： Neelkanth S. Gupte ,  Tejas Mahendra ,  Mukesh Sharma ,  Akshay Baljekar

IPC: F24F11/85 ,  F25B49/02 ,  F24F1/00 ,  F24F1/0033

Abstract: Embodiments of the present disclosure are directed to a heating and cooling system includes a heat exchanger configured to place an airflow and a refrigerant in thermal communication with one another, where the heat exchanger has a coil and a plurality of fans coupled to the coil, and where the plurality of fans is arranged in an array adjacent to the coil.