MOTOR, CIRCUIT BOARD, AND ENGINE COOLING MODULE INCLUDING THE MOTOR

    公开(公告)号:US20180337578A1

    公开(公告)日:2018-11-22

    申请号:US15980726

    申请日:2018-05-15

    IPC分类号: H02K9/22 H02K11/30 H02K1/27

    摘要: The present disclosure relates to a motor, a circuit board and an engine cooling module including the motor. The motor includes a stator, the stator includes a control module and a heat sink, the control module includes a circuit board and a plurality of heat generating electronic components mounted on a top surface of the circuit board, a plurality of ceramic heat conducting members is embedded inside the circuit board at positions facing the heat generating electronic components, and the heat sink is attached on a bottom surface of the circuit board. The motor has improved heat dissipation effect.